Reliability, Machine Learning And Advanced Packaging


Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

EDA, IP Revenues Up Again


EDA and IP revenues were up across the board yet again, buoyed by growth across a number of new markets and an increase in new and existing companies developing chips for those markets. All told, revenue grew to $2.39 billion in Q2 of 2018, an 8.2% increase over the $2.21 billion reported in the same period in 2017, according to numbers released today by the ESD Alliance's Market Statistics ... » read more

Is Cloud Computing Suitable for Chip Design?


Is semiconductor design being left behind in a cloud-dominated world? Finance, CRM, office applications and many other sectors have made the switch to a cloud-based computing environment, but the EDA industry and its users have hardly started the migration. Are EDA needs and concerns that different from everyone else? We are starting to see announcements from EDA companies, but few cheerleaders... » read more

Betting Big On Discontinuity


Wally Rhines, president and CEO of Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about the booming chip industry, what's driving it, how long it will last and what changes are ahead in EDA and chip architectures. What follows are excerpts of that conversation. SE: The EDA and semiconductor industries are doing well right now. What's driving that growth? Rhine... » read more

Enabling Cheaper Design


While the EDA industry tends to focus on cutting edge designs, where design costs are a minor portion of the total cost of product, the electronics industry has a very long tail. The further along the tail you go, the more significant design costs become as a percent of total cost. Many of those designs are traditionally built using standard parts, such as microcontrollers, but as additional... » read more

Accelerating SoC Time To Market With Cloud-Based Verification


This paper discusses the growing use of cloud and hybrid cloud environments among semiconductor design and verification teams. The schedule and efficiency benefits seen by verification teams using cloud are specifically highlighted, due to the considerable compute requirements associated with verification of advanced node SoCs, and the significant impact verification has on the overall SoC proj... » read more

Using More Verification Cores


Semiconductor Engineering sat down to talk about parallelization efforts within EDA with Andrea Casotto, chief scientist for Altair; Adam Sherer, product management group director in the System & Verification Group of Cadence; Harry Foster, chief scientist for Mentor, a Siemens Business; Vladislav Palfy, global manager for applications engineering at OneSpin; Vigyan Singhal, chief Oski for ... » read more

The Rising Cost Of 5G


Semiconductor Engineering sat down to talk about challenges and progress in 5G with Yorgos Koutsoyannopoulos, president and CEO of Helic; Mike Fitton, senior director of strategic planning and business development at Achronix; Sarah Yost, senior product marketing manager at National Instruments; and Arvind Vel, director of product management at ANSYS. What follows are excerpts of that conversat... » read more

Big Shifts In Tech Conferences


By Ed Sperling and Katherine Derbyshire Identifying central themes in technology conferences, or finding enough latitude where the theme is extremely well defined, is becoming challenging throughout the tech industry. Throughout the semiconductor industry, in particular, many are asking how various organizations will differentiate conferences in the future and who will be the target audience... » read more

Agile Standards


Semiconductor Engineering sat down with Lu Dai, chairman for Accellera and senior director of engineering at Qualcomm, to discuss what's changing in standards development. What follows are excerpts of that conversation. SE: Accellera has had a great first half of the year. Dai: Yes, we are only half way through the year and yet we got Portable Stimulus Standard (PSS) out, the SystemC CCI ... » read more

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