tag: edge computing

More Manufacturing Issues, More Testing
By Ed Sperling - 08 Feb, 2022 - Comments: 0

Douglas Lefever, CEO of Advantest America, sat down with Semiconductor Engineering to talk about changes in test, the impact of advanced packaging, and business changes that are happening across the flow. What follows are excerpts of that discussion. SE: What are the big changes ahead in test? Lefever: It's less about inflection points and more like moving from algebra to calculus in the ... » read more

Hybrid architecture based on two-dimensional memristor crossbar array and CMOS integrated circuit for edge computing
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "The fabrication of integrated circuits (ICs) employing two-dimensional (2D) materials is a major goal of semiconductor industry for the next decade, as it may allow the extension of the Moore’s law, aids in in-memory computing and enables the fabrication of advanced devices beyond conventional complementary metal-oxide-semiconductor (CMOS) technology. However, most circuital demons... » read more

Evaluation of Thermal Imaging on Embedded GPU Platforms for Application in Vehicular Assistance Systems
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "This study is focused on evaluating the real-time performance of thermal object detection for smart and safe vehicular systems by deploying the trained networks on GPU & single-board EDGE-GPU computing platforms for onboard automotive sensor suite testing. A novel large-scale thermal dataset comprising of > 35,000 distinct frames is acquired, processed, and open-sourced in challengin... » read more

How Inferencing Differs From Training in Machine Learning Applications
By Sam Fuller - 06 Jan, 2022 - Comments: 0

Machine learning (ML)-based approaches to system development employ a fundamentally different style of programming than historically used in computer science. This approach uses example data to train a model to enable the machine to learn how to perform a task. ML training is highly iterative with each new piece of training data generating trillions of operations. The iterative nature of the tr... » read more

Manufacturing Shifts To AI Of Things
By John Koon - 06 Jan, 2022 - Comments: 0

AI is being infused into the Internet of Things, setting the stage for significant improvements in manufacturing productivity, improved uptime, and reduced costs — regardless of market segment. The traditional approach to improving manufacturing equipment reliability and efficiency is regular scheduled maintenance. While that is an improvement over just fixing or replacing equipment when i... » read more

Sustainability, Ecosystems, And Consumer Requirements In 2022
By Frank Schirrmeister - 22 Dec, 2021 - Comments: 0

Last December, my 2021 outlook focused on "industry transformations" across different verticals. I had referenced a lot of the ongoing transformations in hyperscale computing, aerospace/defense, automotive, and healthcare. 2021 didn't disappoint—most of what I discussed further accelerated pace. For instance, pretty much no booth felt complete at the annual Army AUSA event if they were not... » read more

Next Steps For Panel-Level Packaging
By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

Enablers And Barriers For Connecting Diverse Data
By Anne Meixner - 09 Nov, 2021 - Comments: 0

More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

HBM3: Big Impact On Chip Design
By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

The Everything New Syndrome
By Ed Sperling - 12 Oct, 2021 - Comments: 0

Technology is all about the latest features, the fastest processing, with the lowest power. While that sounds great in marketing pitch, any or all of those factors don't necessarily equate to a better product or long-term user satisfaction. There's a reason semiconductor companies are conservative by nature. They want to know that when they spend tens or hundreds of millions of dollars on a ... » read more

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