3 Big Challenges For 5G

By Ed Sperling - 06 Sep, 2018 - Comments: 0

The general assumption is that we will all be walking around with 5G phones in our pockets someday, but 5G devices may look more like a home router, a car, or maybe even a tablet than a smart phone. There are three main problems that need to be solved here. The big one is coverage, and that gets confusing because it depends on which version of 5G people are talking about. There are at least ... » read more

IIoT Edge Is A Moving Target

By Kevin Fogarty - 06 Sep, 2018 - Comments: 0

Edge computing happens in an industrial IoT (IIoT) system wherever it needs to happen. The business needs for an IIoT system—or one layer of that system—will determine when and where the computing happens. This conclusion, from an introductory report written by the IoT testing organization the Industrial Internet Consortium (IIC), helps explain why no one consistently can say what edge... » read more

Variation In Low-Power FinFET Designs

By Ann Mutschler - 30 Aug, 2018 - Comments: 1

One of the biggest advantages of moving to the a leading edge process node is ultra-low voltage operation, where devices can achieve better performance using less power. But the latest generation process nodes also introduce a number of new challenges due to increased variation that can affect everything from signal integrity to manufacturing yield. While variation is generally well understo... » read more

More Performance At The Edge

By Ed Sperling - 09 Aug, 2018 - Comments: 0

Shrinking features has been a relatively inexpensive way to improve performance and, at least for the past few decades, to lower power. While device scaling will continue all the way to 3nm and maybe even further, it will happen at a slower pace. Alongside of that scaling, though, there are different approaches on tap to ratchet up performance even with chips developed at older nodes. This i... » read more

New Roadmap For Electronics

By Ed Sperling - 19 Jul, 2018 - Comments: 0

Tech Talk: Melissa Grupen-Shemansky, CTO for SEMI’s FlexTech Group and Advanced Packaging program, looks at what’s changing now that Moore’s Law is slowing, and how packaging is changing as the traditional physical boundaries of electronics begin breaking down. https://youtu.be/UpH1m8Oru90 » read more

7nm Design Challenges

By Ed Sperling - 09 Jul, 2018 - Comments: 0

Ty Garibay, CTO at ArterisIP, talks about the challenges of moving to 7nm, who’s likely to head there, how long it will take to develop chips at that node, and why it will be so expensive. This also raises questions about whether chips will begin to disaggregate at 7nm and 5nm. https://youtu.be/ZqCAbH678GE » read more

Defining Edge Memory Requirements

By Ann Mutschler - 20 Jun, 2018 - Comments: 0

Defining edge computing memory requirements is a growing problem for chipmakers vying for a piece of this market, because it varies by platform, by application, and even by use case. Edge computing plays a role in artificial intelligence, automotive, IoT, data centers, as well as wearables, and each has significantly different memory requirements. So it's important to have memory requirement... » read more

Blazing-Fast Performance

By Ed Sperling - 14 Jun, 2018 - Comments: 0

When it comes to raw performance, there's nothing like a supercomputer. Until recently, though, most of this was simply bragging rights about whose supercomputer was faster. A trillion calculations (petaflop), more or less, doesn't mean that much outside of scientific circles. What's changing is that companies and governments now can utilize these blazing fast machines across a wider swath o... » read more

Chip Dis-Integration

By Brian Bailey - 14 Jun, 2018 - Comments: 2

Just because something can be done does not always mean that it should be done. One segment of the semiconductor industry is learning the hard way that continued chip integration has a significant downside. At the same time, another another group has just started to see the benefits of consolidating functionality onto a single substrate. Companies that have been following Moore's Law and hav... » read more

System-Level Power Modeling Takes Root

By Ann Mutschler - 10 May, 2018 - Comments: 0

Power, heat, and their combined effects on aging and reliability, are becoming increasingly critical variables in the design of chips that will be used across a variety of new and existing markets. As more processing moves to edge, where sensors are generating a tsunami of data, there are a number of factors that need to be considered in designs. On one side, power budgets need to reflect th... » read more

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