How Much AI Is Really Needed?

By John Koon - 05 Oct, 2023 - Comments: 0

Tensor Core GPUs have created a generative AI model gold rush. Whether it’s helping students with math homework, planning a vacation, or learning to prepare a six-course meal, generative AI is ready with answers. But that's only one aspect of AI, and not every application requires it. AI — now an all-inclusive term, referring to the process of using algorithms to learn, predict, and make... » read more

Performance Benchmarking Embedded FPGAs

By Flex Logix - 03 May, 2023 - Comments: 0

This Application Note has the following objectives: Provide performance benchmark achievable on the various EFLX IP Cores currently available; Provide performance variation for different process nodes; Provide performance benchmarks to compare with other embedded FPGAs. Click here to read more. » read more

Improving PPA When Embedding FPGAs Into SoCs

By Ed Sperling - 31 Jan, 2023 - Comments: 0

Embedded FPGAs have been on everyone’s radar for years as a way of extending the life of chips developed at advanced nodes, but they typically have come with high performance and power overhead. That’s no longer the case, and the ability to control complex chips and keep them current with changes to algorithms and various protocols is significant step. Geoff Tate, CEO of Flex Logix, talks a... » read more

Embedded FPGA Basics

By Flex Logix - 06 Mar, 2019 - Comments: 0

You do not need know about FPGAs to integrate reconfigurable RTL into your SoC: our software maps your RTL into our EFLX array for you. But if you are curious, read on. FPGAs are field programmable gate arrays. They offer a different kind of programmability from processors. Processors are sequential while FPGAs enable massive parallelism. A processor has one adder, one multiplier—an ... » read more

Benchmarks For The Edge

By Ed Sperling - 07 Feb, 2019 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about benchmarking in edge devices, particularly for convolutional neural networks. https://youtu.be/-beVEpKAM4M » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 10 Aug, 2018 - Comments: 0

Cybersecurity Jens (Atom) Steube, a cybersecurity researcher and creator of the Hashcat password cracking tool, was probing for vulnerabilities in the new WPA3 security standard for Wi-Fi routers. WPA3 presents a robust defense against hacking, yet Steube discovered a security flaw in routers using WPA/WPA2 – one that leaves Wi-Fi passwords enabled with Pairwise Master Key Identifiers vulner... » read more

AI, ML Chip Choices

By Ed Sperling - 07 Aug, 2018 - Comments: 0

Flex Logix’s Cheng Wang talks about which types of chips work best for neural networks, AI and machine learning. https://youtu.be/k7OdP7B10o8 » read more

Auto Chip Test Getting Harder

By Kevin Fogarty - 06 Aug, 2018 - Comments: 3

Chipmakers and test/validation companies are helping lead the effort to develop self-driving cars, but they are facing a wide range of technical and even cultural barriers. Advanced driver assist systems (ADAS) already are the most complex systems by far in modern cars, the best of which hover between Level 2 and Level 3 on the five-step autonomy ladder maintained by the Society of Automotiv... » read more

FPGAs Drive Deeper Into Cars

By Ann Mutschler - 09 Jul, 2018 - Comments: 3

FPGAs are reaching deeper and wider inside of automobiles, playing an increasingly important role across more systems within a vehicle as the electronic content continues to grow. The role of FPGAs in automotive cameras and sensors is already well established. But they also are winning sockets inside of a raft of new technologies, ranging from the AI systems that will become the central logi... » read more

Predictions: Methodologies And Tools

By Brian Bailey - 25 Jan, 2018 - Comments: 0

Predictions are divided into four posts this year. Part one covered markets and drivers. The second part looked at manufacturing, devices and companies and this part will cover methodologies and tools. In addition, the outlook from EDA executives will be provided in a separate post. Intellectual property As designs get larger, it should be no surprise that the size of the [getkc id="43" kc_... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?