Open-Source RISC-V Cores: Analysis Of Scalar and Superscalar Architectures And Out-Of-Order Machines


A new technical paper titled "Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, Out-of-Order Execution" was published by researchers at ETH Zurich, Università di Bologna and Univ. Grenoble Alpes, Inria. Abstract "Open-source RISC-V cores are increasingly demanded in domains like automotive and space, where achieving high instructions per cycle (IPC) throu... » read more

Quantifying The PFAS Impact In ICs Manufacturing (Harvard University)


A new technical paper titled "Modeling PFAS in Semiconductor Manufacturing to Quantify Trade-offs in Energy Efficiency and Environmental Impact of Computing Systems" was published by researchers at Harvard University and Mohamed Bin Zayed University of AI (MBZUAI). "The electronics and semiconductor industry is a prominent consumer of per- and poly-fluoroalkyl substances (PFAS), also known a... » read more

Energy-Efficient Computing Systems For Sustainable AI


As artificial intelligence (AI) proliferates rapidly, AI models and datasets are also growing rapidly in size. This growth far outpaces performance improvement in hardware systems, and is increasing AI’s energy consumption unsustainably. To address these challenges and explore collaborative solutions, SEMI’s Smart Data-AI Initiative – as part of its Future of Computing focus – r... » read more

Energy-Aware DL: The Interplay Between NN Efficiency And Hardware Constraints (Imperial College London, Cambridge)


A new technical paper titled "Energy-Aware Deep Learning on Resource-Constrained Hardware" was published by researchers at Imperial College London and University of Cambridge. Abstract "The use of deep learning (DL) on Internet of Things (IoT) and mobile devices offers numerous advantages over cloud-based processing. However, such devices face substantial energy constraints to prolong batte... » read more

Is Liquid Cooling Right for Your Data Center: eBook


As data centers face rising chip densities and energy costs, liquid cooling is emerging as a powerful solution. But is it the right fit for your facility? This eBook covers the essentials to help you decide. Who Should Read This eBook: -Senior management of data center operations -Data center designers and consultants -Engineers in IT and facilities management Key Takeaways: -Lear... » read more

Silicon Reimagined: New Foundations For The Age of AI


The semiconductor industry is undergoing a pivotal transformation driven by the rise of artificial intelligence (AI) and the slowing of traditional Moore’s Law scaling.  In this comprehensive 42 page report, several key trends shaping the industry’s future are highlighted. The push toward more specialized architectures tailored for specific workloads, particularly in AI. The critic... » read more

Lines Blurring Between Supercomputing And HPC


Supercomputers and high-performance computers are becoming increasingly difficult to differentiate due to the proliferation of AI, which is driving huge performance increases in commercial and scientific applications and raising similar challenges for both. While the goals of supercomputing and high-performance computing (HPC) have always been similar — blazing fast processing — the mark... » read more

Maximizing Energy Efficiency in Subthreshold RISC-V Cores (NTNU)


A new technical paper titled "Optimizing Energy Efficiency in Subthreshold RISC-V Cores" was published by researchers at Norwegian University of Science and Technology (NTNU). Abstract "Our goal in this paper is to understand how to maximize energy efficiency when designing standard-ISA processor cores for subthreshold operation. We hence develop a custom subthreshold library and use it to ... » read more

Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)


A new technical paper titled "High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions" was published by researchers at TSMC. Abstract: "The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by Artificial Intelligence a... » read more

Direct-To-Chip Liquid-Cooled Data Centers (Binghamton, Nvidia)


A new technical paper titled "Parameters of performance: A deep dive into liquid-to-air CDU assessment" was published by researchers at Binghamton University-SUNY and NVIDIA. Abstract: "The rapid growth in data center workloads and the increasing complexity of modern applications have led to significant contradictions between computational performance and thermal management. Traditional air... » read more

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