Golden Signoff ECO For Last-Mile Electronic Design Closure

By Manoj Chacko - 03 Oct, 2022 - Comments: 0

Electronic design developers really hate iterative, resource-intensive tasks that occur late in the project schedule. Most engineers are under tremendous time to market (TTM) pressure due to competition while being told that they must minimize the cost of both the project and the end chip. In addition, they are struggling to meet power, performance, and area (PPA) requirements far more aggressi... » read more

ECO Should Not Stand For Extended Challenge Order

By Manoj Chacko - 25 Aug, 2022 - Comments: 0

There’s an old saying that the first 90% of a task takes 90% of the schedule, and the remaining 10% takes the other 90% of the time. In chip development, design-signoff closure has become one such task. Ideally, when the design has been placed and routed (physical implementation), final analysis of timing and other metrics is performed and an engineering change order (ECO) file is issued to t... » read more

3 Ways To Improve Design Collaboration: Part 2

By Amit Varde - 04 Jun, 2020 - Comments: 0

In the last blog in this series, we talked about how VDD can help design and layout engineers work more efficiently. Communicating precise and accurate information is a key factor in improving productivity, estimates, and the planning process. Visualizing the changes makes it easier to follow the technical details. The ECO (Engineering Change Order) phase is an important phase in the lifecycle... » read more

Pressure Builds To Revamp The Design Flow

By Ed Sperling - 23 Apr, 2015 - Comments: 1

Without [getkc id="7" kc_name="EDA"] there would be no [getkc id="74" comment="Moore's Law"] as we know it today, and without Moore's Law there would be a much more limited need for EDA. But after more than three decades of developing design flows packed with sophisticated tools to automate semiconductor design through verification, and thereby enable feature shrinks that are the basis of Moore... » read more

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tag: engineering change order

Golden Signoff ECO For Last-Mile Electronic Design Closure

ECO Should Not Stand For Extended Challenge Order

3 Ways To Improve Design Collaboration: Part 2

Pressure Builds To Revamp The Design Flow

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