5G & IoT

By Jeff Dorsch - 02 Feb, 2017 - Comments: 0

“Designing to Evolving 4G and Pre-5G Requirements” was the title of a Tuesday morning tutorial at DesignCon 2017 in Santa Clara, Calif. Talk of 5G naturally segued into Internet of Things discussion during the session. Parviz Yegani, a consultant with GHB Intellect, laid out the IoT use cases that could be enhanced by 5G technology: Shopping, population-dense urban areas, remote computin... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 30 Sep, 2016 - Comments: 0

Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

The Week in Review: IoT

By Jeff Dorsch - 19 Aug, 2016 - Comments: 1

Technology The Internet of Things got some attention at this week’s Intel Developer Forum in San Francisco. Intel CEO Brian Krzanich introduced the Joule compute module in his opening-day keynote address. The module is a high-performance developer platform supporting Intel RealSense depth-sensing cameras. Canonical, Microsoft, and PivotHead were among the IDF exhibitors demonstrating the Jou... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 25 Sep, 2015 - Comments: 0

Samsung Semiconductor unveiled its North American R&D Headquarters for its Device Solutions group in San Jose, Calif. The new campus is a 1.1 million-square-foot R&D, sales and marketing center. Is 5G the next big thing in wireless? Verizon–the first company to introduce 4G LTE–is once again poised to usher in a new era with an aggressive roadmap for fifth-generation, or 5G, wireless t... » read more

IoT Standards Needed

By Ed Sperling - 02 Oct, 2014 - Comments: 0

The promise of the [getkc id="76" comment="Internet of Things"] is effortless communication between devices, all of which are smart enough to transmit data to the Internet directly, or through connecting hubs, and to ad hoc devices that are authorized to be added to a personal or industrial network. What's not yet clear is how that promise will be realized. Even though many devices are desig... » read more

Blog Review: June 18

By Ed Sperling - 18 Jun, 2014 - Comments: 1

Mentor’s Vern Wnek recalls “a living hell” of being trapped in a small office for three weeks with a PCB designer who ate too much garlic and sweated profusely. This could be a reality TV series. What do engineers really think about UVM? Cadence's Richard Goering braved a 7 a.m. breakfast at DAC to hear a panel of experts, including reps from Intel, Ericsson, Imagination and Freescale,... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it?

by Brian Bailey

tag: Ericsson

5G & IoT

The Week In Review: Manufacturing

The Week in Review: IoT

The Week In Review: Manufacturing

IoT Standards Needed

Blog Review: June 18

Trending Articles

NAND Flash Targets 1,000 Layers

Testing For Thermal Issues Becomes More Difficult

Auto Chip Aging Accelerates In Hot Climates

Is In-Memory Compute Still Alive?

Top-Down Vs. Bottom-Up Chiplet Design

Knowledge Centers
Entities, people and technologies explored