tag: ESD Alliance

The State Of The EDA Industry In 2024
By Bob Smith - 21 Nov, 2024 - Comments: 0

In what has become a yearly custom, I recently spoke to Jay Vleeschhouwer, Managing Director of Griffin Securities, for an update on his view of the state of the electronic design automation (EDA) industry. My inquiries were based on his presentation at the 2024 Design Automation Conference (DAC). With his long background as an informed EDA industry follower, I knew it would be an enlightening ... » read more

Chip Industry Week In Review
By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Blog Review: Aug. 28
By Jesse Allen - 28 Aug, 2024 - Comments: 0

Synopsys' Jon Ames checks out how the Ultra Ethernet Consortium aims to revolutionize networking by optimizing Ethernet for the rapidly evolving AI and HPC workloads by addressing critical issues like tail latency that are encountered by machine learning algorithms in large compute clusters. Cadence's Kos Gitchev introduces the DDR5 Multiplexed Rank DIMM (MRDIMM), a memory module technology ... » read more

Blog Review: Aug. 14
By Jesse Allen - 14 Aug, 2024 - Comments: 0

Cadence's Dimitry Pavlovsky highlights two new features in the AMBA CHI protocol Issue G update that enhance security of the Arm architecture: Memory Encryption Contexts, which allows data in each Realm in the memory to be encrypted with a different encryption key, and Device Assignment, which introduces hardware provisions to support fully coherent caches in partially trusted remote coherent d... » read more

Chip Industry Week In Review
By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

Blog Review: June 19
By Jesse Allen - 19 Jun, 2024 - Comments: 0

Siemens' John McMillan and Todd Burkholder suggest using an automatic formal-based approach to verifying chiplet package connections early in the design process. Cadence's Veena Parthan explores the intricacies of wind tunnel testing in automotive design and how the collaborative relationship between computational fluid dynamics (CFD) and wind tunnels has resulted in accelerated and more nua... » read more

Blog Review: June 12
By Jesse Allen - 12 Jun, 2024 - Comments: 0

Cadence's Deep Mehta finds that PCIe 6.0 switches need advanced verification strategies that delve deeper than basic functionality, such as generating backpressure traffic to identify potential performance bottlenecks and ensure the switch operates optimally in real-world scenarios. Siemens' Reetika explains why proper management and verification of reset domain crossing (RDC) paths are cruc... » read more

Blog Review: April 24
By Jesse Allen - 24 Apr, 2024 - Comments: 0

Cadence's Vatsal Patel notes the factors that make high-bandwidth memory ideal for AI, such as improved bandwidth and area from vertical stacking and power reduction features like data bus inversion. Synopsys' Rob van Blommestein points to early power network analysis as a way to ensure that enough power is delivered to each transistor to mitigate potential power-related issues within the ch... » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Blog Review: Mar. 27
By Jesse Allen - 27 Mar, 2024 - Comments: 0

Cadence's Steve Brown suggests that multi-die technologies will be a key part of the path toward a faster, more efficient chip ecosystem that can support the compressed development cycles now emerging in the automotive industry. Synopsys' John Swanson, Madhumita Sanyal, and Priyank Shukla point to the role of simulation in ensuring seamless operation in the Ethernet ecosystem though rigorous... » read more

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