tag: eSilicon

Stacked Die Moves From Drawing Board To Reality
By Ed Sperling - 21 Nov, 2013 - Comments: 0

After decades of moving in a straight line from one process geometry shrink to the next, much of the semiconductor industry has taken a step back to figure out what comes next. While companies such as Intel, IBM and Samsung continue to look as far ahead as the 3nm process node, along with new materials to improve electron mobility and new transistor designs based on electron tunneling and carbo... » read more

From DFM To IFM
By Ed Sperling - 14 Nov, 2013 - Comments: 0

For the past decade the bridge between design and manufacturing was called, appropriately enough, design for manufacturing. DFM tools, which by nature cross boundaries of what previously were discrete segments in the semiconductor flow, are now critical for complex designs. They allow design teams to check early in the design process whether chips will yield sufficiently and to incorporate rule... » read more

Uncertainty Increases About What’s Next
By Ed Sperling - 24 Oct, 2013 - Comments: 0

Across the semiconductor industry, there is a lot of talk about what’s next. Lithography advances have stalled, NRE and mask costs are rising, and complexity is exploding. But unlike the 1 micron wall, which was supposed to be impenetrable, there is no single issue holding back progress. Instead, there are lots of them, most with pricey workarounds, but which together become more complicat... » read more

New Pain And Inflection Points
By Ed Sperling - 24 Oct, 2013 - Comments: 0

Jack Harding, CEO of eSilicon, talks with Semiconductor Engineering about the explosion in the costs and the risk of semiconductor designs at the leading edge of Moore's Law. [youtube vid=HLS5QhnGHfM] » read more

CSR In Semis
By Jack Harding - 24 Oct, 2013 - Comments: 0

For decades the largest industries in the world have deployed corporate social responsibility (CSR) initiatives that, on their surface, are designed to “give back” or “share the wealth” with the communities that have produced the labor force that drive their collective success. We also are told that CSR is good business and can be correlated with improved branding and greater profitabil... » read more

Experts At The Table: Who Takes Responsibility?
By Ed Sperling - 10 Oct, 2013 - Comments: 0

Semiconductor Engineering sat down with John Koeter, vice president of marketing and AEs for IP and systems at Synopsys; Mike Stellfox, technical leader of the verification solutions architecture team at Cadence; Laurent Moll, CTO at Arteris; Gino Skulick, vice president and general manager of the SDMS business unit at eSilicon; Mike Gianfagna, vice president of corporate marketing at Atrenta; ... » read more

Experts At The Table: Who Takes Responsibility?
By Ed Sperling - 04 Oct, 2013 - Comments: 0

By Ed Sperling Semiconductor Engineering sat down with John Koeter, vice president of marketing and AEs for IP and systems at Synopsys; Mike Stellfox, technical leader of the verification solutions architecture team at Cadence; Laurent Moll, CTO at Arteris; Gino Skulick, vice president and general manager of the SDMS business unit at eSilicon; Mike Gianfagna, vice president of corporate market... » read more

The Week In Review: Oct. 4
By Mark LaPedus - 04 Oct, 2013 - Comments: 0

By Mark LaPedus & Ed Sperling eSilicon introduced an automated multi-project wafer quote system, which allows companies to sort through a number of options and get pricing. The quotes are tied into TSMC's 20nm to 350nm processes, and GlobalFoundries’ 20nm to 180nm processes. The approach eliminates the need for companies to buy a full wafer if their volume requirements don’t warrant it... » read more

The Week In Review: Sept. 27
By Ed Sperling - 27 Sep, 2013 - Comments: 0

By Ed Sperling Applied Materials shook up the equipment market, announcing a deal to buy Tokyo Electron for about $9.3 billion in stock. The combination of No. 2 Applied and No. 3 TEL in that market equals a new No. 1, surpassing Dutch giant ASML in terms of revenue. Mentor Graphics rolled out a new versiion of its computational fluid dynamics product, adding Monte Carlo radiation modeling... » read more

Buying And Selling EDA Companies
By Ed Sperling - 26 Sep, 2013 - Comments: 0

By Ed Sperling Buying companies is the easy part. Integrating them is the hard part. It’s also the point where most acquisitions that go awry actually run into problems. There are widely different strategies for how to accomplish integration. Sometimes they work, other times they don’t. And sometimes both companies are surprised by the outcome—for better or worse. “Either you thi... » read more

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