Power Delivery Challenges For AI Chips
Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.
Novel Assembly Approaches For 3D Device Stacks
ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged optics.
Startup Funding: Q2 2025
New architectures and manufacturing methods draw investors; 75 startups raise $1.9 billion.
Chip Industry Week in Review
$60B fab buildout; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence's virtual platform buy; multi-chiplet NoC; HBM roadmap; MIT's GaN fab technique; 30% tax credit; Taiwan export restrictions, power vulnerability; global memory market; rad-tolerant memory; 2D, non-silicon computer.
EDA’s Top Execs Map Out An AI-Driven Future
AI is accelerating the need for 3D-ICs and digital twins, and causing lots of disruption along the way.
RISC-V’s Increasing Influence
Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need a bridge to get to where it needs to be.
Development Flows For Chiplets
A chiplet economy requires standards, organization, and tools — and that's a problem.
Chiplet Tradeoffs And Limitations
Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on power, performance, and cost.
Implementing AI Activation Functions
Why flexibility, area, and performance are traded off in AI inferencing designs.
Die-to-die Interconnect Standards In Flux
Many features of UCIe 2.0 seen as “heavy” are optional, causing confusion.
The Best DRAMs For Artificial Intelligence
The choice of DRAM depends on where the action is.
Future-proofing AI Models
The rate of change in AI algorithms complicates the decision-making process about what to put in software, and how flexible the hardware needs to be.
AI Accelerators Moving Out From Data Centers
Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, but it's not the only one.
