Big Shifts In Power Electronics Packaging
Packages are becoming more complex to endure high power, high temperature conditions across a variety of applications.
Chip Industry Week In Review
$3B for packaging program; DARPA's 3DHI; AI yield improvement tool; OpenAI CEO reinstated; EV consumer sentiment; SiC market projections; RISC-V security model; AI edge devices; ESD discharge; ML in failure analysis.
Chip Industry Week In Review
German chipmakers cleared to stake in TSMC foundry; Synopsys makes big bet on RISC-V; Keysight takes 50.6% share in ESI; self-assembling nanosheets; cheap EVs; Teradyne's JV with Technoprobe; auto chiplets; new approach to mitigating rowhammer.
AI Accelerator Architectures Poised For Big Changes
Design teams are racing to boost speed and energy efficiency of AI as it begins shifting toward the edge.
DRAM Choices Are Suddenly Much More Complicated
The number of options and tradeoffs is exploding as multiple flavors of DRAM are combined in a single design.
RISC-V Wants All Your Cores
It is not enough to want to dominate the world of CPUs. RISC-V has every core in its sights, and it's starting to take steps to get there.
SRAM In AI: The Future Of Memory
Why SRAM is viewed as a critical element in new and traditional compute architectures.
ReRAM Seeks To Replace NOR
There is increased interest in ReRAM for embedded computing, especially in automotive applications, as more of its known issues are solved. Nevertheless, there is no one-size-fits-all NVM.
Sweeping Changes For Leading-Edge Chip Architectures
Large language models and huge data volumes are prompting innovation at every level.
Flipping Processor Design On Its Head
AI workloads are changing processor design in some unexpected ways.
CXL: The Future Of Memory Interconnect?
Why this standard is gaining traction inside of data centers, and what issues still need to be solved.
Patterns And Issues In AI Chip Design
Devices are getting smarter, but they're also consuming more energy and harder to architect; change is a constant challenge.
Chip Industry Week In Review
Apple security fix; Intel-Tower deal; Synopsys’ AI push; China’s trade violations; chip architecture shift; AMD buys AI Mipsology; TSMC’s photonics bet.
