Flash Getting Stacked High-Bandwidth Version
Inspired by HBM, HBF could improve AI efficiency in 3D flash memory.
Can Edge AI Keep Up?
As models evolve faster than silicon cycles, experts weigh how much adaptability architects can afford without sacrificing power, area, or efficiency.
Chiplets Need A New Workflow
Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to identify risks early and scale reliably.
Agentic AI Is Changing Data Center Architectures
Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce latency, and boost efficiency.
Gates Add Functionality, But Wires Create Problems
Wires are treated as a lesser concern, but their neglect is becoming critical at advanced nodes.
A New Era For Co-Processing
Processor architectures are evolving faster than ever, but they still lag the pace of AI development. Chip architects must predict what will be required tomorrow in designs today.
PCIe Benefits From AI, Despite Scaling Protocols
CXL is also gaining traction in AI processing, while MIPI and others are growing at the edge.
DRAM’s Whac‑A‑Mole Security Crisis
New refresh commands chase Rowhammer and Rowpress, but a permanent fix remains years away.
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