RISC-V Heralds New Era Of Cooperation

By Brian Bailey - 30 May, 2024 - Comments: 0

RISC-V is paving the way for open source to become accepted within the hardware community, creating a level of industry collaboration never seen in the past, while revitalizing the connection between academia and industry. The big question is whether this arrangement is just a placeholder while the industry re-learns how to develop processors, or whether this processor architecture is someth... » read more

Technical Paper Round-Up: March 15

By Linda Christensen - 15 Mar, 2022 - Comments: 0

Research is expanding across a variety of semiconductor-related topics, from security to flexible substrates and chiplets. Unlike in the past, when work was confined to some of the largest universities, that research work is now being spread across a much broader spectrum of schools on a global basic, including joint research involving schools whose names rarely appeared together. Among the ... » read more

Manufacturing Bits: March 8

By Mark LaPedus - 08 Mar, 2016 - Comments: 1

5G mmWave consortium Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. Carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Radio-frequency (RF... » read more

System Bits: March 17

By Ann Mutschler - 17 Mar, 2015 - Comments: 0

Symmetry in graphene growth According to Rice University researchers, what lies beneath growing islands of graphene is important to its properties. The team analyzed patterns of graphene – a single-atom-thick sheet of carbon – grown in a furnace via chemical vapor deposition and discovered that the geometric relationship between graphene and the substrate, the underlying material on whi... » read more

System Bits: Oct. 28

By Ann Mutschler - 28 Oct, 2014 - Comments: 0

Sensing objects without looking at them In a technique known as “interaction-free measurement,” Yale engineers have created a chip-scale device that senses the presence of an object without interacting with it by using the wave-particle duality of single photons. This work could help propel the field of quantum information processing. The researchers explained that the device uses silic... » read more

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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RISC-V Heralds New Era Of Cooperation

Technical Paper Round-Up: March 15

Manufacturing Bits: March 8

System Bits: March 17

System Bits: Oct. 28

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