Startup Funding: July 2023

By Jesse Allen - 02 Aug, 2023 - Comments: 0

Investors pumped more than $2.8 billion into 123 companies July. It was a particularly strong month for photonics companies, with a photonic integrated circuit foundry raising more than $100 million. Startups this month also are using photonic technology in innovative ways. This includes an all-optical RISC processor, biomarker identification, faster fully homomorphic encryption, and more AI... » read more

Heterogenous Computing & Cache Attacks

By Technical Paper Link - 12 Aug, 2022 - Comments: 0

Researchers at imec-COSIC, KU Leuven presented this paper titled "Double Trouble: Combined Heterogeneous Attacks on Non-Inclusive Cache Hierarchies" at the USENIX Security Symposium in Boston in August 2022. Note, this is a prepublication paper. Abstract: "As the performance of general-purpose processors faces diminishing improvements, computing systems are increasingly equipped with domai... » read more

Manufacturing Bits: Oct. 22

By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

System Bits: Aug. 27

By Jeff Dorsch - 27 Aug, 2019 - Comments: 0

A ring of 18 carbon atoms Scientists at IBM Research – Zurich and Oxford University write about allotropes of carbon – the many versions of atomic carbon formations, such as diamonds and graphite. “Carbon, one of the most abundant elements in the universe, can exist in different forms - called allotropes - giving it completely different properties from color to shape to hardness. For... » read more

Manufacturing Bits: Nov. 27

By Mark LaPedus - 27 Nov, 2018 - Comments: 0

New kilogram definition After years of debate and scientific work, a group of delegates from 60 countries have voted to redefine four key unit measurements—the kilogram, electric current (ampere), temperature (kelvin), and the amount of substance (mole). The vote took place at the recent 26th General Conference of Weights and Measures. Hosted by the International Bureau of Weights and Mea... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: European Research Council

Startup Funding: July 2023

Heterogenous Computing & Cache Attacks

Manufacturing Bits: Oct. 22

System Bits: Aug. 27

Manufacturing Bits: Nov. 27

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Entities, people and technologies explored