The Road To Osmosis

By Rob van Blommestein - 27 Oct, 2021 - Comments: 0

It’s happening. Some may have speculated that, with the acquisition of OneSpin by Siemens, the OneSpin user group meeting, more commonly known as Osmosis, would be formally (pun intended) absorbed into a larger Siemens event. Well, I’m here to tell you that Osmosis is officially on the books and will continue to focus on the specific area of formal verification. The team has been working di... » read more

Moderating A Panel

By Brian Bailey - 27 Jun, 2019 - Comments: 0

When I was a technologist at Mentor, I used to be asked to sit on panels. I loved to provide my opinions on just about anything. As soon as I became independent, the industry believed that I could serve it better as a moderator. That was not an easy transition to make. The first few panels that I moderated were probably not very good. I like to think that I have improved over the years, and the... » read more

Advanced ASICs: It Takes An Ecosystem

By Mike Gianfagna - 30 Nov, 2017 - Comments: 0

I remember the days of the IDM (integrated device manufacturer). For me, it was RCA, where I worked for 15 years as the company changed from RCA to GE and then ultimately to Harris Semiconductor. It’s a bit of a cliché, but life was simpler then, from a customer point of view at least. RCA did it all. We designed all the IP, did the physical design, owned fabs, assembly and test facilities a... » read more

The Week In Review: Design

By Jesse Allen - 07 Apr, 2017 - Comments: 0

Name Changes Arteris changed its name to ArterisIP. The company said the name change better reflects what the company does, which is provide IP for SoC communication on-die and between die. Mentor Graphics also modified its name, following last week's announcement that the acquisition by Siemens has been completed. The company is now officially called Mentor, A Siemens Business. It also ... » read more

Advanced ASICs Are A Team Sport

By Mike Gianfagna - 23 Feb, 2017 - Comments: 0

The recent Super Bowl proved that a team with conviction and focus can do anything. This notion comes in handy when you think about the nearly impossible job of designing and manufacturing an advanced ASIC – in finFET technologies, with an interposer, multiple die, and never-before-proven throughput rates. For these kind of advanced technologies, it does take a village. What works is open, tr... » read more

Does Hardware/Software Verification Have To Be Broad And Deep? Check Out DVCon 2017

By Frank Schirrmeister - 23 Feb, 2017 - Comments: 0

DVCon 2017 is upon us next week and even though it is called the “Design and Verification” conference, it is rising more and more to the system level. One of the aspects of interest is how verification seems to simultaneously become broader—covering more aspects to verify like software, power and performance—while also becoming more deep when it comes to application domains and their sp... » read more

Find Your Way To San Jose Next Week… For DVCon, Of Course!

By Dave Kelf - 23 Feb, 2017 - Comments: 0

If you’re asked “Do you know the way to San Jose?” in the next few days, chances are it’s a newbie to DVCon. Everyone else in chip design verification knows the way to the annual Design and Verification Conference and Exhibition about to convene at the San Jose DoubleTree Hotel. This year’s program is stacking up to be an insightful and educational four days of tutorials, paper ses... » read more

Formal Has Its Day

By Dave Kelf - 28 Jul, 2016 - Comments: 0

As new technologies receive more mainstream attention, it is common for the experts in the area to provide a critical mass of enthusiasm. Formal is in this mode with multiple meetings throughout the year and around the globe. Perhaps one of the most successful of these is the annual Formal Day event put on by Test & Verification Solutions (TVS) based in the UK. This live and online event is... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: events