The Week In Review: Manufacturing


Chipmakers At an event, Intel’s Technology and Manufacturing group outlined the company's vision. As part of the event, Intel reiterated what many are saying—the current node designations are meaningless and misleading. “For example, Intel estimates that its 14nm solution that has been out in the market since 2014 should be equal to 10nm solutions released by competitors in the near futu... » read more

The Week In Review: IoT


Conferences The number of IoT and IoT-related conferences continues to grow, but IoT also is beginning to make inroads into established conferences. The Mobile World Congress, held this week in Barcelona, Spain, teemed with Internet of Things announcements from many companies. SEMICON Southeast Asia, scheduled for April 25-27 at SPICE in Penang, Malaysia, will feature the World of IoT: Futur... » read more

The Week In Review: Manufacturing


Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

The Week In Review: Manufacturing


Intel has submitted a business plan to upgrade its fab in Israel, according to reports. Crocus Nano Electronics (CNE), the joint venture founded in 2011 by Crocus Technology and Russia’s RUSNANO, has raised $60 million from its investors. The venture is Russia’s first 300mm fab. This first production line was completed one year after construction began. Currently, 200mm and 300mm CMOS wa... » read more

Week In Review: Manufacturing, Design, Test


A new study from Crucial.com reveals that on some days, 64% of U.S. parents spend more time with their computers than with family or close friends. TSMC posted mixed results in the fourth quarter of 2013. It also announced flat CapEx targets for 2014. TSMC also addressed Intel’s recent comments about TSMC’s finFET plans. Morris Chang, chairman of TSMC, said Intel’s comments are mislead... » read more

The Week In Review: July 15


By Mark LaPedus There are more problems surfacing with extreme ultraviolet (EUV) lithography. Yes, the light source remains a problem, but the resists appear to be in decent shape. “The next challenge is the mask blank,” said Stefan Wurm, director of Sematech’s lithography program. The new problem involves ion beam deposition, which apparently is causing defects and overfill on EUV masks... » read more