tag: fan-outs

How Healthy Is The Chip Market?
By Ed Sperling - 22 Feb, 2016 - Comments: 1

By Ed Sperling & Ann Steffora Mutschler The inclusion of semiconductors in more products across more market segments—many of which historically have not been large consumers of chips—is having a big impact on how they are designed and manufactured, as well as how they are tracked and quantified. In the past, semiconductor sales were so closely tied to the success of personal computers... » read more

Will 3D-IC Work?
By Ed Sperling - 11 Feb, 2016 - Comments: 3

Advanced packaging is becoming real on every level, from fan-outs to advanced fan-outs, 2.5D, and 3D-ICs for memory. But just how far 3D and monolithic 3D will go isn't clear at this point. The reason is almost entirely due to heat. In a speech at SEMI's Integrated Strategy Symposium in January, Babek Sabi, Intel corporate VP and director of assembly and test technology development, warned t... » read more

Fallout From Scaling
By Ed Sperling - 03 Feb, 2016 - Comments: 0

By Ed Sperling & Ann Steffora Mutschler Semiconductor scaling is becoming much more difficult and expensive at each new node, creating sharp divisions about what path to take next for which markets and applications. What used to be confined to one or two clear choices is now turning into a menu of items and possibilities, often with no clear guarantees for a successful outcome. Views ... » read more

Thinking Outside The Chip
By Ed Sperling - 14 Jan, 2016 - Comments: 0

Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

Changes In Chip Design
By Ernest Worthman - 07 Jan, 2016 - Comments: 0

We all know that sub-10nm is coming. But is that really what will define the next generation of semiconductors? Progress in semiconductor technology increasingly is not just about advancements in the hardware. It also involves advancements in applications and technologies peripheral to the devices themselves. That may sound counterintuitive, but going forward the technology, applications and... » read more

Rise Of The Old Fab
By Ed Sperling - 17 Dec, 2015 - Comments: 0

Growth in the [getkc id="260" comment="Internet of Everything"], along with the beginning of a shift toward systems in package, are creating buzz in a rather unlikely place—established and well-worn process nodes where equipment is scarce, semi-functional, and difficult to maintain. In the past, moving to the next node was a sign of progress, leaving behind the trailing edge of designs to ... » read more

How To Choose A Processor
By Ann Mutschler - 10 Dec, 2015 - Comments: 0

Choosing a processor might seem straightforward at first glance, but like many engineering challenges it's harder than it looks. When is a CPU better than a GPU, MCU, DSP or other type of processor? And for what design—or part of a design? For decades, the CPU has been the default choice. “It is deliberately designed to be pretty efficient at all tasks, is straightforward to program, ... » read more

Reflections On 2015
By Brian Bailey - 10 Dec, 2015 - Comments: 0

It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with Semiconductor Engineering. We like to hold people's feet to the fire, but while the "Pants-On-Fire" meter may be applicable to politicians, we ... » read more

Why Packaging Matters
By Ed Sperling - 19 Nov, 2015 - Comments: 1

The semiconductor package is changing. What was until very recently considered an afterthought is now becoming a key part of the design process at all major chipmakers, and a critical factor in the extension of Moore's Law. This is a sharp reversal of what was almost universally an afterthought in planar silicon design and manufacturing. Rarely was the package an integral part of the archite... » read more

More Choices, Less Certainty
By Ed Sperling - 04 Nov, 2015 - Comments: 3

The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

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