ST-Ericsson NovaThor This Year, 28nm FDSOI, Soitec Wafers

By Various Writers - 14 Mar, 2012 - Comments: 0

Big and official FD-SOI news: Soitec has announced that the company is supplying the FD-SOI wafers for ST-Ericsson’s next-generation of NovaThor 8540 smartphone/tablet processors. Starting at the 28nm node, this marks the industry’s first industrialization of the new planar, fully-depleted technology on ultra-thin SOI wafers. Soitec has just issued an official press release, but ST-Eri... » read more

FD-SOI Workshop ppts – STM’s 1st 28nm FD-SOI product line

By Various Writers - 12 Mar, 2012 - Comments: 0

The SOI Consortium’s 6th FD-SOI workshop, held just after ISSCC, yielded some exciting news. Most of the presentations are freely available for downloading from the SOI Consortium website. Here are the highlights. STMicroelectronics In a terrific presentation by Giorgio Cesana, Marketing Director at STMicroelectronics, he revealed that the company would be releasing a major product line b... » read more

FD-SOI – Recent Consortium Results (Part 1 of 3): Manufacturing

By Various Writers - 05 Mar, 2012 - Comments: 0

The most recent SOI Consortium benchmarking study regarding 28nm and 20nm FD-SOI results (silicon-calibrated simulations at the 28nm node of complex circuits including ARM cores and DDR3 memory controllers) covered a lot of ground. This post is part 1 of a 3-part blog series that will be highlighting key points with respect to: 1. manufacturing; 2. power & performance; 3. 20nm benchmarking ... » read more

How Long Will 28nm Last?

By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Ann Steffora Mutschler As soon as a next generation semiconductor manufacturing process node is out, bets are taken on just how long the current advanced process node will last. The 28/20nm transition is no exception. There is certainly a benefit to moving from 40nm to 28nm. The availability of high-k/metal gate technology offers quite a few advantages in terms of power reduction... » read more

FD-SOI bests FinFETs for mobile multimedia SOCs? ST says yes.

By Various Writers - 29 Nov, 2011 - Comments: 0

In a recent and excellent article in ASN by Thomas Skotnicki, Director of the Advanced Devices Program at STMicro, he explains in a very clear and accessible way why FD-SOI with ultra-thin Body & Box (UTBB) is a better solution for mobile, multimedia SOCs than FinFETs -- starting at the 28nm node and running clearly through 8nm. It is based on the paper he presented at the 2011 IEEE SOI C... » read more

ARM: Bulk ports directly to FD-SOI

By Various Writers - 17 Nov, 2011 - Comments: 0

In a recent ASN posting, ARM Fellow Jean-Luc Pelloie said that bulk logic designs can be ported directly to fully-depleted (FD)-SOI for high-performing, low-power mobile apps. ARM sees fully-depleted FD-SOI is a potential alternative to BULK 20nm. Jean-Luc addressed the question of what sort of impact a port from bulk FD-SOI would have on the design flow. His answer is: very little. ... » read more

CMP, ST et al offer 28nm FD-SOI for prototyping, research

By Various Writers - 06 Nov, 2011 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ What would a port to 28nm FD-SOI do for your design? A recent announcement by CMP, STMicroelectronics and Soitec invites you to find out. Specifically, ST’s CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process – which uses innovative silicon substrates from Soitec and incorporates robust, compact model... » read more

SOI Conference Shows SOI Driving Key Roadmaps

By Various Writers - 21 Oct, 2011 - Comments: 0

By Adele Hars The 2011 IEEE SOI Conference, held in Tempe, AZ last week was not one to miss…but I did. Happily, I got the papers right away, along with observations shared by some of the folks who did get there. Highlights include excellent and insightful papers from ST, ARM, IBM, Intel, Leti, Peregrine and GlobalFoundries, plus many more that indicate SOI-based technologies are at th... » read more

FD-SOI Foundations Ready, Say Semi Execs

By Various Writers - 09 Sep, 2011 - Comments: 0

By Adele Hars SOI (especially fully depleted “FD-SOI”) was a hot topic in the video and audio interviews that Debra Vogler of SST released recently. Here are brief summaries of the most important SOI-related interviews – with top brass from Leti, Soitec, KT, EVG and Qcept – that she made at Semicon West ’11. (If you need a quick backgrounder on FD-SOI basics, see this exp... » read more

Study Shows FD-SOI Most Cost-Effective Approach at 22nm

By Various Writers - 02 Aug, 2011 - Comments: 0

By Adele Hars What are you doing at 22nm? The debate is raging in the press and forums alike. Now research firm IC Knowledge has issued a report showing that from a straight cost perspective, planar FD-SOI is a better choice than bulk. We’ve known for a while that sticking with bulk at the 22nm node would get pretty complicated. This study shows just how complicated bulk will be: abou... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: FD-SOI