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Memory Startups To Watch


The next-generation memories are finally ramping up after years’ of delays and promises. Intel, for one, is shipping 3D XPoint, a next-generation technology based on phase-change memory. In addition, the big foundries are readying embedded MRAM. And, of course, there are a number of other players in the next-generation memory arena. There are also a number of startups that are flying un... » read more

Week In Review: Manufacturing, Test


Chipmakers Last year, Micron filed suit against UMC, alleging that UMC stole memory technology from the company and transferred it to Jinhua Integrated Circuit Co., a DRAM maker in China. In response, UMC filed patent infringement lawsuits against Micron in the mainland China courts in January of 2018 This week, Micron appears to have suffered a legal setback in its suit against Taiwanâ€... » read more

Transistor Options Beyond 3nm


Despite a slowdown in chip scaling amid soaring costs, the industry continues to search for a new transistor type 5 to 10 years out—particularly for the 2nm and 1nm nodes. Specifically, the industry is pinpointing and narrowing down the transistor options for the next major nodes after 3nm. Those two nodes, called 2.5nm and 1.5nm, are slated to appear in 2027 and 2030, respectively, accord... » read more

A New Memory Contender?


Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more