Week in Review: IoT, Security, Auto


Internet of Things NXP Semiconductors provided its A71CH trust anchor to Google IoT Cloud, enabling authentication for Google IoT Cloud Core. The technology helps to secure edge devices for Internet of Things deployments. Separately, NXP announced the promotion of Kurt Sievers, executive vice president and general manager of the chip company’s automotive business, to president of NXP Semicon... » read more

Week in Review: IoT, Security, Auto


Cybersecurity Check Point Software Technologies reports that facsimile machines (yes, people still use them!) can be subject to hacking through vulnerabilities in their communication protocols. The HP Officejet Pro All-in-One fax printers and other fax machines can be compromised with a hacker only knowing a fax number, according to the company. Check Point Research says a design flaw in Andro... » read more

AI, ML Chip Choices


Flex Logix’s Cheng Wang talks about which types of chips work best for neural networks, AI and machine learning. https://youtu.be/k7OdP7B10o8 » read more

Sandia Labs’ New Configurable SoC


At DAC 2018, held in June in San Francisco, Sandia Labs made a public presentation for the first time describing its first SoC using eFPGA, called Dragonfly. This is the first public disclosure by any organization describing its requirements, architecture and use cases for the new technology option of embedded FPGA. John Teifel led the project for Sandia National Laboratories. Sandia has ... » read more

Data Center Power Poised To Rise


The big power-saving effort that kept U.S. data-center power consumption low for the past decade may not keep the lid on much longer. Faced with the possibility that data centers would consume a disastrously large percentage of the world's power supply, data center owners, and players in the computer, semiconductor, power and cooling industries ramped up effort to improve the efficiency of e... » read more

Architecting For AI


Semiconductor Engineering sat down to talk about what is needed today to enable artificial intelligence training and inferencing with Manoj Roge, vice president, strategic planning at Achronix; Ty Garibay, CTO at Arteris IP; Chris Rowen, CEO of Babblelabs; David White, distinguished engineer at Cadence; Cheng Wang, senior VP engineering at Flex Logix; and Raik Brinkmann, president and CEO of O... » read more

Reconfigurable AI Building Blocks For SoCs And MCUs


FPGA chips are in use in many AI applications today, including Cloud datacenters. Embedded FPGA (eFPGA) is now becoming used for AI applications as well. Our first public customer doing AI with EFLX eFPGA is Harvard University, who will present a paper at Hot Chips August 20th on Edge AI processing using EFLX: "A 16nm SoC with Efficient and Flexible DNN Acceleration for Intelligent IoT Devi... » read more

FPGAs Drive Deeper Into Cars


FPGAs are reaching deeper and wider inside of automobiles, playing an increasingly important role across more systems within a vehicle as the electronic content continues to grow. The role of FPGAs in automotive cameras and sensors is already well established. But they also are winning sockets inside of a raft of new technologies, ranging from the AI systems that will become the central logi... » read more

Embedded FPGA Design Considerations


Geoff Tate, CEO of Flex Logix, talks about interconnects, memory, different design approaches, and why foundry processes are critical to eFPGA design. https://youtu.be/FngrgDnJn9c » read more

Week In Review: Design, Low Power


M&A Siemens acquired Austemper Design Systems, which provides tools for functional safety and safety-critical designs. Founded in 2015, Texas-based Austemper adds state-of-the-art safety analysis, auto-correction and fault simulation technology to address random hardware faults, as well as correct and harden vulnerable areas, subsequently performing fault simulation to ensure the design is... » read more

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