Design Tool Think Tank Required

By Brian Bailey - 29 Feb, 2024 - Comments: 1

When I was in the EDA industry as a technologist, there were three main parts to my role. The first was to tell customers about new technologies being developed and tool extensions that would be appearing in the next release. These were features they might find beneficial both in the projects they were undertaking today, and even more so, would apply to future projects. Second, I would try and ... » read more

The End Of Closed EDA

By Brian Bailey - 22 Sep, 2022 - Comments: 0

In a previous life, I was a technologist for a large EDA company. One of my primary responsibilities in that position involved talking to a lot of customers to identify their pain points, and what new tools we could develop that would ease their problems. You would think that would be an easy task, but it certainly was not the case. For example, if you ask a developer what their biggest frus... » read more

Hyper-Convergence Is The New Normal For Digital Implementation

By Yudhan Rajoo - 23 Sep, 2021 - Comments: 0

The era of smart-everything has led to a surge in the need for semiconductor devices across a myriad of traditional and novel applications. These applications demand high performance yet energy-efficient compute over blazing-fast networks to service trillions of edge devices that are constantly consuming and generating large amounts of data. This surge has invigorated system architects to innov... » read more

3 Ways To Improve Design Collaboration: Part 3

By Simon Rance - 07 Jan, 2021 - Comments: 0

The first two blog posts in this three-part series focused on the design team’s capability to communicate efficiently. An accurate to-do list is the basis of providing accurate estimates for project release schedules. The Cliosoft VDD (Visual Design Diff) tool is an effective way to maintain a live and accurate “to-do list” for design engineers and managers alike. Additionally, it provide... » read more

The Single Best DFT Move You Can Make

By Jay Jahangiri - 08 Oct, 2019 - Comments: 0

A proven method to simplify a complex problem is to break it into smaller chunks. In the case of today’s large, complex SoCs, this means using hierarchical methods to design the blocks, then combine the results at the top level. While this sounds obvious, it hasn’t always been practical or technologically feasible to perform some tasks, like DFT, at the block level and translate that work s... » read more

Synthesizing Computer Vision Designs To Hardware

By Mike Fingeroff - 26 Jul, 2018 - Comments: 0

Computer vision is one of the hottest markets in electronic design today. Digital processing of images and video with complex algorithms in order to interpret meaning has almost as many applications and markets as there are uses for the human eye. The biggest problem that designers face is that the computer vision system requirements and algorithms change quickly and often. Even the targ... » read more

Design Flows At 5nm And Beyond

By Mark Richards - 26 Apr, 2018 - Comments: 0

It’s probably the first time that you’ll ever hear an old (well, old-ish!) person say this, but things were easier back in my day. 40 nanometers was the most advanced node that I ever designed SoCs at and, although it wasn’t easy back then, it pales against the myriad of challenges facing designers today. Back then, compartmentalization of function and roles was relatively easy. We do ... » read more

The Week In Review: Design

By Jesse Allen - 23 Mar, 2018 - Comments: 0

M&A Synopsys acquired Silicon and Beyond, a provider of high-speed SerDes and ADC/DAC IP. The company was founded in 2012 as SilabTech and headquartered in Bangalore. Synopsys highlighted the team of R&D engineers with high-speed SerDes expertise that would be joining with the acquisition. Terms of the deal were not disclosed. ANSYS will acquire OPTIS, a provider of software for sci... » read more

Plugging Gaps In Advanced Packaging

By Ann Mutschler - 27 Sep, 2017 - Comments: 0

The growing difficulty of cramming more features into an SoC is driving the entire chip industry to consider new packaging options, whether that is a more complex, integrated SoC or some type of advanced packaging that includes multiple chips. Most of the work done in this area so far has been highly customized. But as advanced packaging heads into the mainstream, gaps are beginning to appea... » read more

Going Open Source

By Dave Kelf - 26 May, 2016 - Comments: 2

Open Source often is thought of as an alternative to commercial software licensed using fairly typical business models. For example, variants of open source Linux supplied by companies such as Red Hat charge a subscription for support and maintenance. Maybe there is an opportunity to leverage Open Source alongside commercial EDA software to provide use model advantages and open development f... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?