Building Better Bridges In Advanced Packaging


The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what works best for different processes and technologies. At its core, advanced packaging depends on reliable interconnects, well-def... » read more

Paving The Way To Chiplets


The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet standards, and a cost analysis tool for determining the feasibility of a given chiplet-based design, are two new and important pieces. Along with other efforts, the goal is to propel the chiplet m... » read more

A Production-Worthy Fan-Out Solution — ASE FOCoS Chip Last


The 5th Generation (5G) wireless systems popularity will push the package development into a high performance and heterogeneous integration form. For high I/O density and high performance packages, the promising Fan Out Chip on Substrate (FOCoS) provides a solution to match outsourced semiconductor assembly and testing (OSAT) capability. FOCoS is identified the Fan Out (FO) package, which can f... » read more

The Next Advanced Packages


Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Challenges For Future Fan-Outs


The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1µm line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Fig. 1: Redistribution layers. Source: L... » read more