Week In Review: Design, Low Power

By Jesse Allen - 07 Feb, 2020 - Comments: 0

Presto Engineering, an outsourced operations provider to semiconductor and IoT device manufacturers, acquired the DELTA Microelectronics business unit of FORCE Technology. The acquisition adds DELTA's ASIC design and manufacturing to its portfolio. The two companies will retain a strong relationship: FORCE Technology has become a shareholder of Presto Engineering and Juan Farré, FORCE’s CTO,... » read more

Silicon Photonics Begins To Make Inroads

By Kevin Fogarty and Ed Sperling - 09 Jul, 2019 - Comments: 1

Integrating photons and electrons on the same die is still a long way off, but advances in packaging and improvements in silicon photonics are making it possible to use optical communication for a variety of new applications. Utilizing light-based communication between chips, or in self-contained modules, ultimately could have a big impact on chip design. Photons moving through waveguides ar... » read more

The Limits Of Energy Harvesting

By Ed Sperling and Kevin Fogarty - 09 May, 2019 - Comments: 4

Energy harvesting, once considered an inexpensive alternative to low-power design and a way of achieving nearly unlimited power in mobile devices, has settled down to more modest expectations. This approach to generating energy through a variety of means—from solar to motion to ambient RF and even pH differences between soil and trees—has been proven to work. The problem is that it doesn... » read more

Hidden Soldier Joints Inspection: 4 Case Studies

By DELTA, a part of FORCE Technology - 07 May, 2019 - Comments: 0

IC packaging technologies are becoming smaller and thinner. Ball grid array (BGA) packages were introduced some years ago in order to save space on the PCB, and are now widely used. To overcome the resulting problems with using optical microscopy as an inspection tool, the endoscope found its way into quality engineering departments. To read more, click here. » read more

Gaps Emerge In Automotive Test

By Ed Sperling - 07 May, 2019 - Comments: 1

Demands by automakers for zero defects over 18 years are colliding with real-world limitations of testing complex circuitry and interactions, and they are exposing a fundamental disconnect between mechanical and electronic expectations that could be very expensive to fix. This is especially apparent at leading-edge nodes, where much of the logic is being developed for AI systems and image se... » read more

New Approaches To Security

By Ed Sperling - 09 Apr, 2019 - Comments: 0

Different approaches are emerging to identify suspicious behavior and shut down potential breaches before they have a chance to do serious damage. This is becoming particularly important in markets where safety is an issue, and in AI and edge devices where the rapid movement of data is essential. These methods are a significant departure from the traditional way of securing devices through l... » read more

X-Ray Reveals Wire Bonding And Field Failures

By DELTA, a part of FORCE Technology - 09 Apr, 2019 - Comments: 0

Wire bonding is widely used for first-level interconnection of semiconductor die to component leads or pads. It is vital that the interconnection corresponds to the product-specific bonding diagram and that the wire bonding is of an acceptable robustness and quality. X-ray technology is critical for ensuring both. To read more, click here. » read more

Shedding Pounds In Automotive Electronics

By Susan Rambo - 12 Mar, 2019 - Comments: 2

Weight is emerging as a key concern for carmakers as more electronic circuitry is added into vehicles that are either fully or partially powered by batteries. As a result, chipmakers and OEMs are exploring alternative substrate materials, different types of sensor fusion, and new ways to reduce the number of wires. Adding pounds reduces driving range for electric or hybrid vehicles. The auto... » read more

Using Sensor Data To Improve Yield And Uptime

By Ed Sperling - 21 Feb, 2019 - Comments: 2

Semiconductor equipment vendors are starting to add more sensors into their tools in an effort to improve fab uptime and wafer yield, and to reduce cost of ownership and chip failures. Massive amounts of data gleaned from those tools is expected to provide far more detail than in the past about multiple types and sources of variation, including when and where that variation occurred and how,... » read more

Reliability Becomes The Top Concern In Automotive

By Ed Sperling And Susan Rambo - 12 Feb, 2019 - Comments: 4

Reliability is emerging as the top priority across the hottest growth markets for semiconductors, including automotive, industrial and cloud-based computing. But instead of replacing chips every two to four years, some of those devices are expected to survive for up to 20 years, even with higher usage in sometimes extreme environmental conditions. This shift in priorities has broad ramificat... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?