X-Ray Reveals Wire Bonding And Field Failures

An essential tool in initial stages of non-destructive IC failure analysis


Wire bonding is widely used for first-level interconnection of semiconductor die to component leads or pads.

It is vital that the interconnection corresponds to the product-specific bonding diagram and that the wire bonding is of an acceptable robustness and quality. X-ray technology is critical for ensuring both. To read more, click here.

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