Using Sensor Data To Improve Yield And Uptime


Semiconductor equipment vendors are starting to add more sensors into their tools in an effort to improve fab uptime and wafer yield, and to reduce cost of ownership and chip failures. Massive amounts of data gleaned from those tools is expected to provide far more detail than in the past about multiple types and sources of variation, including when and where that variation occurred and how,... » read more

Reliability Becomes The Top Concern In Automotive


Reliability is emerging as the top priority across the hottest growth markets for semiconductors, including automotive, industrial and cloud-based computing. But instead of replacing chips every two to four years, some of those devices are expected to survive for up to 20 years, even with higher usage in sometimes extreme environmental conditions. This shift in priorities has broad ramificat... » read more

A Longer Life For LED Power Electronics


One of the greater challenges with LED lighting is the electronic driver’s robustness to normally occurring transients or power surges in the network. Many everyday examples have shown that the active electronics in the light sources find it hard to handle the effects in a use environment, in which incandescent bulbs and lamps with passive electronics have functioned fine for decades. A new p... » read more

The Growing Promise Of Printed Electronics


Printing electronics using conductive ink rather than lithography is starting to move out of the research phase, with chipmakers now looking at how to commercialize this technology across a broad range of sensor applications. Unlike traditional semiconductors, which use tiny wires as circuits, printed electronics rely on conductive inks and often flexible films, although they can be printed ... » read more

5 Best Practices For Successfully Managing An ASIC Supply Chain


Managing an end-to-end ASIC supply chain is one of the primary challenges of chip projects. Not only is the process long and complex, but it involves multiple technologies, dependencies and stakeholders. In this paper, we've assembled five best practices to help you translate ASIC specifications into a final product through a smooth supply chain process, including: Avoid costly time-... » read more

Week In Review: Manufacturing, Test


Chipmakers Amid ongoing delays with its 10nm process, Intel has reorganized its manufacturing unit, according to a report from The Oregonian/OregonLive. Sohail Ahmed, who has jointly led the unit since 2016, will retire next month, according to the report. The industry is racing to put extreme ultraviolet (EUV) lithography into production. TSMC recently taped-out its first 7nm chip using E... » read more