tag: FormFactor

Chiplet Reliability Challenges Ahead
By Ed Sperling - 12 Aug, 2020 - Comments: 2

Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

5G Brings New Testing Challenges
By Bryon Moyer - 11 Aug, 2020 - Comments: 0

As 5G nears commercial reality, makers of chips and systems that will support 5G will need to take on the standard burden of characterizing and testing their systems to ensure both performance and regulatory adherence. Millimeter-wave (mmWave) and beamforming capabilities present the biggest testing challenges. “5G is expected to have the extended coverage plus the bandwidth to harness ... » read more

Considerations For 5G Production Test
By David Viera - 11 Aug, 2020 - Comments: 0

Like all technology advancements, bringing 5G to market requires an array of supporting tools to ensure the end products meet expectations. It will require significant performance advances in chip technology and manufacturing processes—all the while keeping price/performance at an economically viable level. Earlier this year, FormFactor’s Daniel Bock along with Jeff Damm outlined three c... » read more

Advanced Packaging, Heterogeneous Integration And Test
By FormFactor - 11 Aug, 2020 - Comments: 0

Major products rely on advanced packaging to reach the market; a groundswell of die-integration technologies are revolutionizing packaging, assembly, and test. At this exciting time in the industry, open engagement between customers and suppliers has never been more important for the test community. Click here to read more. » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Jul, 2020 - Comments: 0

Chipmakers and OEMs As reported, Intel this week reorganized its operations following delays with its 7nm technology. Intel is behind TSMC and Samsung in technology. As a result, TSMC’s foundry customers, such as AMD, Nvidia and others, are also pulling ahead of Intel. In addition, reports have surfaced that Intel will outsource some of its leading-edge chip production to TSMC. To solve t... » read more

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Jul, 2020 - Comments: 0

IoT Arm is proposing to transfer its two IoT divisions to SoftBank Group Corp., which will own and operate them under new entities. The two IoT Services Group (ISG) businesses are IoT Platform and Treasure Data. Arm intends to focus more on its IP roadmap in data and compute, once the transfer becomes finalized. It is subject to more board review. “Arm believes there are great opportunities ... » read more

Probing From Home
By Anthony Lord - 07 Jul, 2020 - Comments: 0

The current stay-at-home, work-from-home situation challenges the semiconductor industry in a way we have never seen before. Social distancing and remote work put operational procedures in place that can be difficult. In a previous post, we shared information on our virtual demos designed to help keep your semiconductor measurements running no matter where you are physically located. In this ... » read more

Advanced Packaging Makes Testing More Complex
By Bryon Moyer - 07 Jul, 2020 - Comments: 1

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Test Setup Optimization And Automation For Accurate Silicon Photonics Wafer Acceptance Production Tests
By FormFactor - 07 Jul, 2020 - Comments: 0

Implementing energy-efficient optical transceiver modules with silicon photonics (SiPh) and 3DIC technologies will help alleviate the increasing energy consumption for hyperscale data centers. To facilitate effective 3DIC heterogenous integration of these photonics integrated circuits for optical transceivers, high precision, repeatable and reliable SiPh wafer acceptance tests are essential and... » read more

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