EMEA Investments Driving Technology Specialization

By Liz Allan - 04 Nov, 2024 - Comments: 0

Government programs across Europe and the UK are seeing a surge of investments in leading edge technology, materials, and packaging. Industry and academia are coalescing around specialty areas, drawing on established relationships to foster innovation and fill gaps in regional supply chains while also maintaining international bonds. Government initiatives also are picking up in Israel, Saudi A... » read more

Chip Industry Week In Review

By The SE Staff - 09 Aug, 2024 - Comments: 0

Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

Chip Industry Week In Review

By The SE Staff - 28 Jun, 2024 - Comments: 0

The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing

By eBeam Initiative - 17 Apr, 2024 - Comments: 0

How Advantest Corporation, ASML, Fraunhofer, imec, Siemens EDA and others are using deep learning in semiconductor manufacturing. Click here to read more. » read more

Architecting Chips For High-Performance Computing

By Ann Mutschler - 15 Apr, 2024 - Comments: 0

The world’s leading hyperscaler cloud data center companies — Amazon, Google, Meta, Microsoft, Oracle, and Akamai — are launching heterogeneous, multi-core architectures specifically for the cloud, and the impact is being felt in high-performance CPU development across the chip industry. It's unlikely that any these chips will ever be sold commercially. They are optimized for specific ... » read more

Chip Industry Talent Shortage Drives Academic Partnerships

By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Chip Industry Week In Review

By The SE Staff - 08 Sep, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according to SEMI. Similarly, the top 10 semiconductor foundries reported a 1.1% quarterly-over-quarter revenue decline in Q2. A rebound is anticipated in Q3, according to TrendForce. Synopsys extended its AI-driven EDA ... » read more

Large-Scale Integration’s Future Depends On Modeling

By Karen Heyman - 27 Jul, 2023 - Comments: 0

VLSI is a term that conjures up images of a college textbook, but some of the concepts included in very large-scale integration remain relevant and continue to evolve, while others have fallen by the wayside. The portion of VLSI that remains most relevant for semiconductor industry is "integration," which is pushing well beyond the edges of a monolithic planar chip. But that expansion also i... » read more

Covert Channel Between the CPU and An FPGA By Modulating The Usage of the Power Distribution Network

By Technical Paper Link - 30 Mar, 2023 - Comments: 0

A new technical paper titled "CPU to FPGA Power Covert Channel in FPGA-SoCs" was published by researchers at TU Munich and Fraunhofer Research Institution AISEC. Abstract: "FPGA-SoCs are a popular platform for accelerating a wide range of applications due to their performance and flexibility. From a security point of view, these systems have been shown to be vulnerable to various attacks... » read more

Research Bits: Feb. 28

By Susan Rambo - 28 Feb, 2023 - Comments: 0

Single-molecule switch An international team of researchers have demonstrated a switch on a single fullerene molecule. Using a laser, the team switched the path of an incoming electron. “What we’ve managed to do here is control the way a molecule directs the path of an incoming electron using a very short pulse of red laser light,” said Project Researcher Hirofumi Yanagisawa from the Uni... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Fraunhofer

EMEA Investments Driving Technology Specialization

Chip Industry Week In Review

Chip Industry Week In Review

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing

Architecting Chips For High-Performance Computing

Chip Industry Talent Shortage Drives Academic Partnerships

Chip Industry Week In Review

Large-Scale Integration’s Future Depends On Modeling

Covert Channel Between the CPU and An FPGA By Modulating The Usage of the Power Distribution Network

Research Bits: Feb. 28