Chip Architectures Becoming Much More Complex With Chiplets

By Ed Sperling and Ann Mutschler - 30 Jan, 2025 - Comments: 0

The migration from monolithic SoCs to chiplet-based designs is creating a confusing array of options and tradeoffs for design teams working at the leading edge, and the number of choices is only going to increase as third-party chiplets begin pouring into the market. That hasn't dampened the appetite for chiplets, however, which are deemed essential for future generations of semiconductors f... » read more

Advanced Packaging: A Curse Or A Blessing For Trustworthiness?

By Andy Heinig - 16 Jan, 2025 - Comments: 0

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and critical infrastructure. These sectors depend on electronic systems that are not only powerful but also absolutely reliable and, above all, secure. This represents a major challenge, as the increasing co... » read more

Strain, Stress In Advanced Packages Drives New Design Approaches

By Ann Mutschler - 19 Dec, 2024 - Comments: 2

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools. Unlike in the past, when various components were crammed into a planar SoC on a relatively thick substrate, the new substrates are bei... » read more

Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions

By Andy Heinig - 12 Dec, 2024 - Comments: 0

Chiplets offer great potential for the automotive and industrial sectors, especially as these applications often have high performance requirements but are needed only in small quantities. The modular principle behind chiplets enables efficient design and production: individual components have to be produced only once and can then be flexibly combined to create tailored solutions. This offers m... » read more

Where Is The Software For Shift Left?

By Brian Bailey - 12 Dec, 2024 - Comments: 0

Co-development of hardware and software has been a dream for a long time, but significant hurdles remain. Neither domain is ready with what the other requires at the appropriate time. The earlier something can be done in a development flow, the less likely problems will be found when they are more difficult or expensive to fix. It may require both tool and methodology changes, so that a proc... » read more

Green ICT: The IoT World Also Needs Ecological Awareness

By Volkhard Beyer - 17 Oct, 2024 - Comments: 0

By Volkhard Beyer and Dirk Mayer Microelectronics support the fight against climate change and for a better environment; for example, by intelligently controlling drive units, ensuring optimal operation of energy systems, and monitoring the resource requirements of production processes. Unfortunately, however, the ICT sector itself is one of the fastest-growing emitters of greenhouse gase... » read more

eFuses: Use Cases, Benefits, And Design In The System Context

By Jens Michael Warmuth - 12 Sep, 2024 - Comments: 0

In recent years, the automotive industry has been one of the drivers of innovation in the field of electrical and electronic system safety. This is primarily due to the rapid uptake and, in some cases, already mandatory use of advanced driver assistance systems (ADAS) as well as to the first steps toward (partially) autonomous vehicles. In conventional safety systems, the off state can be as... » read more

Chip Industry Week In Review

By The SE Staff - 09 Aug, 2024 - Comments: 0

Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

Managing Complexity And A Left Shift: Reconfigurable Mixed-Signal Circuits For Complex Integrated Systems

By Bjorn Zeugmann - 08 Aug, 2024 - Comments: 0

By Björn Zeugmann and Benjamin Prautsch The chip market is growing worldwide; it’s projected to nearly double by 2030 to over one trillion dollars. Most of this market is made up of digital functions in the form of logic, microprocessors, and memory. Although analog ICs account for only around 15% of the total, they are key components for overall systems and are therefore almost always pr... » read more

Analog Consolidation Spurs New Round Of Startups

By Bryon Moyer - 08 Aug, 2024 - Comments: 0

A new wave of startups is rising to meet the growing need for specialized analog customization in chip design projects, opening the door to more affordable custom designs. These startups are breathing new life into a sector, which as a result of consolidation has favored only the largest chipmakers. As larger analog companies acquire smaller ones, many companies that were previously engaged ... » read more

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