tag: Fraunhofer IIS/EAS

Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems
By Technical Paper Link - 23 Dec, 2021 - Comments: 0

Abstract: "More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based 2.5-D systems. The division of large system-on-chip dies into smaller chiplets with different technology nodes specific to the chiplet application requirement enables the performance enhancement at the ... » read more

Continuous Integration For Digital Design
By Christian Skubich - 17 Dec, 2021 - Comments: 0

By Christian Skubich and Nico Peter In 2001, the Manifesto for Agile Software Development [1] laid the foundation for many modern software development processes. Today, 20 years later, agile methods are in widespread use in numerous domains. Out of the participants in the study Status Quo (Scaled) Agile 2020 [2], only 9% still relied on classic project management methods. One core element... » read more

Design Meets EDA: Gaps And Countermeasures In Analog/Mixed-Signal IC Design
By Fraunhofer IIS/EAS - 08 Dec, 2021 - Comments: 0

Along the path from specification to silicon, the design of analog/mixed-signal chips comprises a variety of challenges. They are of technological, methodological, organizational, communicational, and business nature. Additionally, large gaps are to be managed among the individual challenges. Still up to now, approaches such as the “four eye principle” are used even in industrial practice i... » read more

Improving Energy And Power Efficiency In The Data Center
By Ann Mutschler - 06 Dec, 2021 - Comments: 0

Energy costs in data centers are soaring as the amount of data being generated explodes, and it's being made worse by an imbalance between increasingly dense processing elements that are producing more heat and uneven server utilization, which requires more machines to be powered up and cooled. The challenge is to maximize utilization without sacrificing performance, and in the past that has... » read more

Gaps In The AI Debug Process
By Brian Bailey - 23 Nov, 2021 - Comments: 0

When an AI algorithm is deployed in the field and gives an unexpected result, it's often not clear whether that result is correct. So what happened? Was it wrong? And if so, what caused the error? These are often not simple questions to answer. Moreover, as with all verification problems, the only way to get to the root cause is to break the problem down into manageable pieces. The semico... » read more

Development Of Distributed Intelligent Systems With The Robot Operating System
By Dirk Mayer - 11 Nov, 2021 - Comments: 0

Networked robotic systems are increasingly prevalent. In addition to industrial robotics now firmly ensconced in manufacturing, applications are also being developed in the areas of logistics, medical technology, and even unmanned aerial vehicles (UAV) and unmanned underwater vehicles (UUV). In general, robotic systems are still centrally controlled by a PLC based on statically planned tasks... » read more

Autoencoder-Based Characterisation Of Passive IEEE 802.11 Link Level Measurements
By Fraunhofer IIS/EAS - 10 Nov, 2021 - Comments: 0

Wireless networks are indispensable in today’s industrial manufacturing and automation. Due to harsh signal propagation conditions as well as co-existing wireless networks, transmission failures resulting in severe application malfunctions are often difficult to diagnose. Remote wireless monitoring systems are extremely useful tools for troubleshooting such failures.However, the completeness ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 29 Oct, 2021 - Comments: 0

Automotive The automotive chip shortage is still affecting automotive OEMs. U.S. automakers Ford and GM reported lower 3rd quarter income year over year related to the chip shortage. They, as well as other automotive OEMs around the world, have had to temporarily shut assembly lines down when chips were not available. Infineon Technologies signed a memorandum of understanding with Hyundai M... » read more

What’s Next For Emulation
By Brian Bailey - 28 Oct, 2021 - Comments: 1

Emulation is now the cornerstone of verification for advanced chip designs, but how emulation will evolve to meet future demands involving increasingly dense, complex, and heterogeneous architectures isn't entirely clear. EDA companies have been investing heavily in emulation, increasing capacity, boosting performance, and adding new capabilities. Now the big question is how else they can le... » read more

Challenges In RF Design
By Roland Jancke - 14 Oct, 2021 - Comments: 0

Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

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