tag: Fraunhofer IIS EAS

Design For Reliability
By Brian Bailey - 15 Feb, 2021 - Comments: 1

Circuit aging is emerging as a mandatory design concern across a swath of end markets, particularly in markets where advanced-node chips are expected to last for more than a few years. Some chipmakers view this as a competitive opportunity, but others are unsure we fully understand how those devices will age. Aging is the latest in a long list of issues being pushed further left in the desig... » read more

Design Support For A Green IoT
By Dirk Mayer - 11 Feb, 2021 - Comments: 0

By Dirk Mayer and Roland Jancke The Internet of Things (IoT) is growing rapidly all around the world. New devices are continually being added, all collecting a variety of data and transmitting them (often wirelessly) to edge devices, which in turn relay the data to the cloud for further processing. It is estimated that in a few years IoT devices will be responsible for over 20% of global ene... » read more

Car Industry Changing Under The Hood
By Ann Mutschler - 07 Jan, 2021 - Comments: 0

After an initial burst of autonomous activity, the automotive ecosystem regrouped, re-evaluated its goals, and is now ready to begin deploying new technologies made possible by modern development approaches and forward-looking vehicle architectures. The pandemic hurt vehicle sales in 2020, but it also gave the OEMs a chance to catch their breath. Panic over announcements from other carmakers... » read more

CEO Outlook: 2021
By Ed Sperling - 04 Jan, 2021 - Comments: 0

The new year will be one of significant transition and innovation for the chip industry, but there are so many new applications and market segments that broad generalizations are becoming less meaningful. Unlike in years past, where sales of computers or smart phones were a good indication of how the chip industry would fare, end markets have both multiplied and splintered, greatly increasin... » read more

Variation Threat In Advanced Nodes, Packages Grows
By Ed Sperling - 21 Dec, 2020 - Comments: 0

Variation is becoming a much bigger and more complex problem for chipmakers as they push to the next process nodes or into increasingly dense advanced packages, raising concerns about the functionality and reliability of individual devices, and even entire systems. In the past, almost all concerns about variation focused on the manufacturing process. What printed on a piece of silicon didn't... » read more

Power Models For Machine Learning
By Brian Bailey - 14 Dec, 2020 - Comments: 1

AI and machine learning are being designed into just about everything, but the chip industry lacks sufficient tools to gauge how much power and energy an algorithm is using when it runs on a particular hardware platform. The missing information is a serious limiter for energy-sensitive devices. As the old maxim goes, you can't optimize what you can't measure. Today, the focus is on functiona... » read more

Re-Architecting SerDes
By Brian Bailey - 10 Dec, 2020 - Comments: 0

Serializer/Deserializer (SerDes) circuits have been helping semiconductors move data around for years, but new process technologies are forcing it to adapt and change in unexpected ways. Traditionally implemented as an analog circuit, SerDes technology has been difficult to scale, while low voltages, variation, and noise are making it more difficult to yield sufficiently. So to remain releva... » read more

Functional Safety For Fail-Operational Systems
By Jens Michael Warmuth - 10 Dec, 2020 - Comments: 0

Functional safety issues have long been an important part of product development wherever machine operations that are potentially dangerous for humans are carried out unattended. However, in terms of electrical and electronic systems, the need has been limited to a few industries such as medical technology and aerospace. Apart from that, the functional safety concepts were only used for niche p... » read more

New Security Approaches, New Threats
By Ed Sperling - 09 Dec, 2020 - Comments: 0

New and different approaches to security are gaining a foothold as the life expectancy for advanced chips increases, and as emerging technologies such as quantum computing threaten to crack even the most complex encryption schemes. These approaches include everything from homomorphic encryption, where data is processed without being decrypted, to different ways of sending and receiving data ... » read more

Using ICs To Shrink Auto’s Carbon Footprint
By Ann Mutschler - 03 Dec, 2020 - Comments: 3

A large portion of the burden for reducing greenhouse gases is being handed off to makers of automotive chips and systems, which are being tasked to make vehicles drive further using less energy and with zero emissions. The effort is critical in battling climate change. According to the U.S. Environmental Protection Agency, the transportation sector represented 28.2% of 2018 greenhouse gas e... » read more

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