tag: Fraunhofer IIS EAS

For Chip Developers, HW/SW Co-Design Key To Data Center Efficiency
By Liz Allan - 31 Jul, 2025 - Comments: 0

Data centers and high-performance computing (HPC) are the primary enablers of today’s power-hungry AI-driven technology, but chip designers, EDA vendors, and the data centers themselves have a long list of options available to them to help curb AI's power consumption. Chip designers play a critical role in ensuring energy efficient processing from the bottom up, whether that is hardware-so... » read more

Multi-Modal AI In EDA Development Flows
By Brian Bailey - 31 Jul, 2025 - Comments: 0

RTL coding is a critical step in the development of semiconductors, but many would argue it is not the most difficult. Things become a lot more complex as you get closer to implementation, and as the system context becomes larger than can be comprehended by text alone. In both cases, layout, timing, power, and many other factors come into play, but none is as easily represented by text, and the... » read more

Crisis Ahead: Power Consumption In AI Data Centers
By Ed Sperling - 21 Jul, 2025 - Comments: 2

AI data centers are consuming energy at roughly four times the rate that more electricity is being added to grids, setting the stage for fundamental shifts in where power is generated, where AI data centers are built, and much more efficient system, chip, and software architectures. The numbers are particularly striking for the United States and China, which are in a race to ramp up AI data ... » read more

Do We Have Enough Standards For An Open-Chiplet Ecosystem?
By Andy Heinig - 17 Jul, 2025 - Comments: 0

For some time now, the semiconductor industry has been discussing the development of an open chiplet ecosystem. The idea is that, rather than having monolithic systems on a chip, it should be possible to combine smaller, specialized chiplets in a modular way – ideally across different manufacturers. Doing so would promise great flexibility with much shorter development times, resulting in muc... » read more

Often Overlooked, PHYs Are Essential To High-Speed Data Movement
By Ann Mutschler - 17 Jul, 2025 - Comments: 0

Over the past couple of decades, the semiconductor industry has evolved from a supporting role for traditional verticals like mobile, automotive, and PCs to a foundational role in those markets, as well as in AI factories and hyperscale data centers. Underlying this transformation is the physical layer (PHY), which has emerged as a critical enabler for data transfer and communications. The P... » read more

AI Pushes High-End Mobile From SoCs To Multi-Die
By Liz Allan - 08 Jul, 2025 - Comments: 0

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, more flexibility, and faster time to market than systems on chip. Monolithic SoCs likely will remain the technology of choice for low-end and midrange mobile devices because of their form factor, proven record, and lower cost. But multi-die assemblies provide more fle... » read more

6G Rollout Will Be A Patchwork At First
By Liz Allan - 08 Jul, 2025 - Comments: 0

6G is expected to begin rolling out in 2030, but advances in 5G will inch cellular technology close enough that it will make the first 6G implementations seem more like just another upgrade. That's just the starting point, though. 6G technology gets much more interesting from there, connecting more devices at a significantly higher data rate, and enabling services that would be unattractive to ... » read more

Mixed Messages Complicate Mixed-Signal
By Brian Bailey - 26 Jun, 2025 - Comments: 0

Several years ago, analog and mixed signal (AMS) content hit a wall. Its contribution to first-time chip failure doubled, and there is no evidence that anything has improved dramatically since then. Some see that the problem is likely to get worse due to issues associated with advanced nodes, while others see hope for improvement coming from AI or chiplets. Fig. 1: Cause of ASIC respins. S... » read more

Model-Based Systems Engineering
By Roland Jancke - 12 Jun, 2025 - Comments: 0

Today’s electronic systems are an increasingly complex combination of hardware and software components. They contain an ever-expanding range of functions, require more computing power, have to operate a wide variety of interfaces, comply with standards, and be compatible with established market solutions. Accommodating all the new functions and expanded capacity may require a larger silicon a... » read more

RISC-V’s Increasing Influence
By Brian Bailey - 12 Jun, 2025 - Comments: 2

The industry is increasingly talking about benefits brought by the RISC-V architecture, but is it even the right starting point? While it may not be perfect, it may provide the flexibility necessary to move forward gradually. Computer architectures and software have followed in the footsteps of processors developed 80 years ago. They aimed to solve sequential, scalar arithmetic problems usin... » read more

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