Manufacturing Bits: May 27

By Mark LaPedus - 27 May, 2014 - Comments: 0

Chip printing process Fraunhofer Institute for Manufacturing Technology and Advanced Materials has developed a novel way to make systems using electronic components, such as resistors, transistors and capacitors. Researchers use simple printers and a robot-assisted production line. The components and other devices made from the technology could be used in various applications, such as digit... » read more

Manufacturing Bits: March 18

By Mark LaPedus - 18 Mar, 2014 - Comments: 0

Magazine chips Semiconductor manufacturing can produce tiny chips. The technology can also enable tiny magazine covers. For example, IBM and National Geographic plan to set a Guinness World Records title for the world's smallest magazine cover. IBM has devised a tiny chisel with a nano-size tip, which is 100,000 times smaller than a sharpened pencil point. [caption id="attachment_10920" ali... » read more

The Week In Review: System-Level Design

By Ed Sperling - 10 Jan, 2014 - Comments: 0

Cadence won a deal with Fraunhofer, which licensed its MPEG codecs for Tensilica HiFi DSP. (Cadence acquired Tensilica last year.) The AAC codecs combine speech and general-purpose audio into a unified system, which simplifies design because it works at any bit rate. Sonics won a deal with MediaTek, which licensed its NoC technology for an upcoming line of SoCs. MediaTek, based in Taiwan, is... » read more

Week In Review: Manufacturing & Design

By Mark LaPedus - 25 Oct, 2013 - Comments: 0

Don’t look now, but Intel is expanding its foundry business. Previously, Intel garnered a small collection of foundry customers. But Intel would not entertain foundry customers that had competitive products based on ARM chips. Apparently, Intel is having a change of heart. “I think they’ve changed their position,” said Nathan Brookwood, a research fellow at Insight 64. “They will do A... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Fraunhofer

Manufacturing Bits: May 27

Manufacturing Bits: March 18

The Week In Review: System-Level Design

Week In Review: Manufacturing & Design