The Week In Review: Manufacturing


Fujitsu Semiconductor and Panasonic’s chip unit announced that the parties have signed a definitive agreement to merge and establish a new fabless IC company. Panasonic isn’t exactly fabless--yet. Recently, Panasonic took its fabs and formed a fab venture with TowerJazz. Meanwhile, as part of the move, Fujitsu and Fujitsu Semiconductor have decided to expand the scope of its foundry op... » read more

The Week In Review: Manufacturing


Here’s a sad commentary on the state of Japan’s electronics industry: Some Japanese electronics giants are converting unused factories and fabs into agricultural growing facilities, according to The Wall Street Journal. Last month, for example, Fujitsu began selling lettuce from the Aizu-Wakamatsu plant. It's officially over. IBM's talks to sell its chip unit to GlobalFoundries have offi... » read more

The Week In Review: Manufacturing


Worldwide semiconductor capital equipment spending is projected to total $37.5 billion in 2014, an increase of 12.2% from 2013 spending of $33.5 billion, according to Gartner. Capital spending will increase 5.5% in 2014 as the industry begins to recover from the recent economic downturn. The 3D NAND market will take longer to develop. Samsung has shipped a 3D NAND device. Micron and SK Hynix... » read more

Better Software. Faster!


As virtual prototyping has seen a wide adoption over the last couple of years, it felt like the right time to work with industry leaders across multiple applications and publish a book that captures the best practices in virtual prototyping. As editor of the book: Better Software. Faster!, I had the privilege to work with some incredibly knowledgeable people who have been deploying virtual prot... » read more

The Week In Review: Sept. 3


By Mark LaPedus The cellular chip supplier landscape is littered with corpses. So will 4G lead to the destruction of Qualcomm and Intel? That’s highly unlikely, according to a blog from Strategy Analytics. “With the recent announcement of a multimode LTE chipset from Intel, it seems likely that Qualcomm and Intel will maintain their status as the top two cellular radio chipset suppliers in... » read more

450mm: Out Of Sync


By Mark LaPedus The IC industry has been talking about it for ages, but vendors are finally coming to terms with a monumental shift in the business. The vast changes involve a pending and critical juncture, where the 450mm wafer size transition, new device architectures and other technologies will likely converge at or near the same time. In one possible scenario, 450mm fabs are projected ... » read more

Scaling The Lowly SRAM


By Mark LaPedus Chipmakers face a multitude of challenges at the 20nm logic node and beyond, including the task of cramming more functions on the same chip without compromising on power and performance. There is one major challenge that is often overlooked in the equation—scaling the lowly static RAM (SRAM). In one key application, SRAM is the component used to make on-chip cache memories... » read more

Converge And Consolidate


Electronics has always been about convergence, and convergence inevitably spawns new companies while forcing consolidation of others. What used to be in a device moved to a board, from a board there has been a perpetual push to put things in a chip. At one point, circa 2000, analog companies claimed that mixed signal chips were a thing of the past and that there would be separate analog chip... » read more

5 Ways To Cut Power


By Ed Sperling Low energy consumption with minimal leakage has emerged as the most competitive element in an IC design, regardless of whether it involves a plug, a battery, or whether it’s powered by a gasoline engine. While components on an SoC aren’t always power-aware, they’ll have to be in the future as consumers focus first on energy efficiency. With rising fuel costs, a concern ... » read more

Grappling With Graphene


By Brian Fuller Silicon CMOS is a tough act to follow. The workhorse building block for the world’s electronics has been delivering for system designers for a half century. Despite hand-wringing over its apparent scalability limits, it shows only vague signs of slowing down. For nearly as many years, it seems, the next great material or alternative to silicon CMOS has popped into the indu... » read more

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