GaN Power Devices Power Up


Key Takeaways: GaN devices are gaining traction due to their ability to tolerate higher voltages. New approaches such as chiplets offer faster switching with less loss. The first applications to benefit from GaN will be low-voltage consumer devices; industrial applications require more work. As electrical power displaces fossil fuels in more applications, system designers ne... » read more

Breakthrough Thin GaN Chiplet Technology


Researchers at Intel Foundry have demonstrated a gallium nitride (GaN) chiplet technology built on 300 mm GaN-on-silicon wafers, marking a significant leap forward in semiconductor design. Presented at the 2025 IEEE International Electron Devices Meeting (IEDM), this work tackles one of the most pressing challenges in modern computing: how to deliver more power, speed, and efficiency in an incr... » read more

The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS, Co-Packaged Optics, And More


In a world where high-bandwidth memory, GPUs, and advanced AI packages are all the rage, it is easy to forget the important role specialty devices play. These unsung heroes of modern life perform critical functions across a wide range of industries, including automotive, telecommunications, data centers, emerging AI hardware ecosystems, and consumer electronics, just like the smartphone in your... » read more

A Guide To Fast Switching GaN Challenges And Solutions


Gallium nitride (GaN) is an ideal material for applications requiring high switching speeds and minimal power losses. While the wide-bandgap material can certainly improve a system’s overall efficiency, it can also be more vulnerable to spurious turn-ons and other design challenges. That’s what makes top-of-the-line packaging, such as Infineon HiRel’s new PowIR-SMD, critical in space powe... » read more

Optimize Digital Payloads With Radiation Hardened GaN


As the demand for greater communication bandwidth continues to grow, next-generation satellites must deliver higher data throughput for digital payloads. This shift to digital payloads requires engineers to reassess key design parameters, such as material needs, operational factors, and radiation robustness, to ensure optimal performance in their space power systems. Infineon HiRel’s new radi... » read more

The Race To Replace Silicon


For over 75 years, silicon has been the dominant material in the evolution of modern electronics, powering everything from smartphones to satellites. But as chipmakers push toward smaller nodes, higher power efficiency, and quantum-scale precision, a pressing question is echoing across fabs and R&D labs worldwide: Is it time to move beyond silicon? In this blog post, we explore the growi... » read more

Research Bits: July 1


Copper-to-copper bonding for GaN integration Researchers from MIT, Georgia Tech, and Air Force Research Laboratory propose a bonding process to integrate gallium nitride (GaN) transistors onto standard silicon CMOS chips. They used the process to create a power amplifier. “We wanted to combine the functionality of GaN with the power of digital chips made of silicon, but without having to ... » read more

Research Bits: June 17


Superlattice castellated FETs Researchers from the University of Bristol and Northrop Grumman Mission Systems discovered a latch-effect in gallium nitride (GaN) that could lead to improved radio frequency device performance, crucial for enabling 6G devices. “We have piloted a device technology, working with collaborators, called superlattice castellated field effect transistors (SLCFETs),... » read more

GaN Power Semiconductors – 2025 Predictions


GaN power semiconductors are on a tremendous growth trajectory. GaN is on its way to reaching more tipping points in its adoption in more industries. Consumer chargers and adapters have been the forerunner, more applications are expected to tip this year, with many others to follow in time. Still, there are some headwinds for GaN to reach this adoption level. Why is that and how can we overcome... » read more

Electrifying Everything: Power Moves Toward ICs


As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next wave of innovation is to bring power control closer to the action — directly on the chip or into a heterogeneous package. This change is driven by a relentless pursuit of efficiency, scala... » read more

← Older posts