The Week In Review: IoT


Finance August Home received $25 million in Series C funding, bringing its total funding to $75 million. Existing investors Bessemer Venture Partners, Comcast Ventures, Maveron, and Qualcomm Ventures were joined by AGL, Liberty Mutual, and SPDG. The Internet of Things startup will use the money to expand operations and to extend its offerings in home access products and services. Prospera, ... » read more

What Does An IoT Chip Look Like?


By Ed Sperling and Jeff Dorsch Internet of Things chip design sounds like a simple topic on the face of it. Look deeper, though, and it becomes clear there is no single IoT, and certainly no type of chip that will work across the ever-expanding number of applications and markets that collectively make up the IoT. Included under this umbrella term are sensors, various types of processors, ... » read more

The Week In Review: Manufacturing


Market research SEMI has released its mid-year forecast at Semicon West. SEMI reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase by 19.8% to a total of $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000. In 2018, 7.7% growth is expected, resulting in an... » read more

The Week In Review: Manufacturing


Chipmakers Inotera, known as Micron Technology Taiwan, suspended its operations after an accident occurred at its Fab 2 facility in Taoyuan City on July 1, according to TrendForce. Inotera is responsible for manufacturing Micron’s LPDDR4 products that go into Apple’s supply chain for the iPhone, according to the market research firm. The problem involved a malfunction in the fab. “Th... » read more

IoT Startups Rake In Cash


Corporate and venture investors are still eagerly backing Internet of Things startups, with more than $850 million committed during the first six months of 2017. This year’s total may not reach the heights of 2014, when investors put more than $5 billion into IoT startups, or 2016, which saw IoT firms receiving about $4.75 billion, the Venture Scanner website estimates. Still, a once white... » read more

The Week In Review: IoT


Finance Trend Micro, the cybersecurity firm, announced a corporate venture fund of $100 million to invest in emerging technology markets, including the Internet of Things. Gartner estimates 26 billion devices will be connected to the Internet by 2020. Products Cisco Jasper introduced the Control Center 7.0 IoT connectivity management platform, with advanced capabilities, premium services, ... » read more

The Week In Review: IoT


Finance Samsara, an Industrial Internet of Things startup, raised $40 million in its Series C financing, led by General Catalyst. Andreesen Horowitz, an existing investor, and Samsara’s founders also participated in the funding round, which values the company at $530 million. The supplier of Internet-connected sensors for industrial and transportation applications has raised a total of $80 m... » read more

The Week In Review: IoT


Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

The Week In Review: Manufacturing


Chipmakers Samsung has formed a new foundry division and rolled out a range of new processes. Specifically, Samsung plans to develop 8nm, 7nm, 6nm, 5nm and 4nm. It also introduced an 18nm FD-SOI technology. GlobalFoundries has provided more details about its 300mm fab plans in China. The company and the Chengdu municipality have announced an investment to develop an ecosystem for its 22nm ... » read more

Samsung Unveils Scaling, Packaging Roadmaps


Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

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