tag: Gartner

Foundry Challenges in 2018
By Mark LaPedus - 27 Dec, 2017 - Comments: 6

The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Dec, 2017 - Comments: 0

Chipmakers, LCD suppliers United Microelectronics Corp. (UMC) has announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The 40nm SST process features a >20% reduction in eFlash cell size and 20-30% macro area over UMC’s 55nm SST technology. Toshiba Electronic Devices & Storage has s... » read more

Will Fab Tool Boom Cycle Last?
By Mark LaPedus - 18 Dec, 2017 - Comments: 2

Fab equipment spending is on pace for a record year in 2017, and it now appears that momentum could continue into 2018. Fab tool vendors found themselves in the midst of an unexpected boom cycle in 2017, thanks to enormous demand for equipment in [getkc id="208" comment="3D NAND"] and, to a lesser degree, [getkc id="93" kc_name="DRAM"]. In the logic/foundry business, however, equipment deman... » read more

State Of The IoT
By Jeff Dorsch - 06 Dec, 2017 - Comments: 1

The Internet of Things represents many things to many people, and many of them are not good. For some it is either a laughingstock or a punching bag. For IT, it is a subject of derision because securing all connected devices at the edge is a nightmare. But in all cases, the general consensus is that the IoT has failed to live up to expectations and a level of hype not seen since the dot-com ... » read more

What’s Next For Atomic Layer Etch?
By Mark LaPedus - 16 Nov, 2017 - Comments: 0

After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE). [getkc id="284" kc_name="ALE"] is is moving into 16/14nm, but it will play a big role at 10/7nm and beyond. The industry also is working on the next wave of ALE technology for advanced logic and memory production. Used by chipmakers fo... » read more

Overlay Challenges On The Rise
By Mark LaPedus - 16 Nov, 2017 - Comments: 2

The overlay metrology equipment market is heating up at advanced nodes as the number of masking layers grows and the size of the features that need to be aligned continue to shrink. Both ASML and KLA-Tencor recently introduced new [getkc id="307" kc_name="overlay"] metrology systems, seeking to address the increasing precision required for lines, cuts and other features on each layer. At 10/... » read more

The Next Phase Of Machine Learning
By Kevin Fogarty - 09 Nov, 2017 - Comments: 0

Machine learning is all about doing complex calculations on huge volumes of data with increasing efficiency, and with a growing stockpile of success stories it has rapidly evolved from a rather obscure computer science concept into the go-to method for everything from facial recognition technology to autonomous cars. [getkc id="305" kc_name="Machine learning"] can apply to every corporate fu... » read more

Securing Smart Homes
By Stacy Collett - 02 Nov, 2017 - Comments: 1

One year after Mirai malware hijacked more than 100,000 connected devices for its botnet and launched a denial of service attack — which briefly blocked access to popular sites such as Netflix, PayPal, Amazon and Twitter — [getkc id="76" kc_name="IoT"] device makers are just beginning to get smarter about home security. Security concerns reach deeper into the home than just the Internet ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Oct, 2017 - Comments: 0

Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Oct, 2017 - Comments: 0

Market research The IC market remains hot, as several market researchers are raising their forecasts--again. Gartner recently raised its overall IC forecast. Now, IC Insights has raised its IC market growth rate forecast for 2017 to 22%, up six percentage points from the 16% increase shown in its mid-year update. In March, IC Insights raised its worldwide IC market growth forecast for 2017 ... » read more

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