tag: Gartner

What Transistors Will Look Like At 5nm
By Mark LaPedus - 18 Aug, 2016 - Comments: 3

Chipmakers are currently ramping up 16nm/14nm finFET processes, with 10nm and 7nm just around the corner. The industry also is working on 5nm. TSMC hopes to deliver a 5nm process by 2020. GlobalFoundries, Intel and Samsung are doing R&D for that node. But 5nm technology presents a multitude of unknowns and challenges. For one thing, the exact timing and specs of 5nm remain cloudy. The... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jul, 2016 - Comments: 2

Market research Worldwide semiconductor capital spending is projected to decline 0.7% in 2016, to $64.3 billion, according to Gartner. This is up from the estimated 2% decline in Gartner's previous quarterly forecast. "Economic instability, inventory excess, weak demand for PC’s, tablets, and mobile products in the past three years has caused slow growth for the semiconductor industry. This ... » read more

To 7nm And Beyond
By Ed Sperling - 21 Jul, 2016 - Comments: 4

Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], and Thomas Caulfield, senior vice president and general manager of Fab 8, sat down with Semiconductor Engineering to discuss future directions in technology, including the next rev of FD-SOI, the future of Moore’s Law, and how some very public challenges will likely unfold. SE: What do you see as the... » read more

Building Faster Chips
By Ed Sperling - 21 Jul, 2016 - Comments: 5

By Ed Sperling and Jeff Dorsch An explosion in IoT sensor data, the onset of deep learning and AI, and the commercial rollout of augmented and virtual reality are driving a renewed interest in performance as the key metric for semiconductor design. Throughout the past decade in which mobility/smartphone dominated chip design, power replaced performance as the top driver. Processors ha... » read more

E-beam Vs. Optical Inspection
By Mark LaPedus - 11 Jul, 2016 - Comments: 0

The wafer inspection business is heating up as chipmakers encounter new and tiny killer defects in advanced devices. Last month ASML Holding entered into an agreement to acquire Hermes Microvision (HMI), the world’s largest e-beam inspection vendor, for $3.1 billion. The proposed move propelled ASML into the e-beam wafer inspection market. In addition, [getentity id="22817" e_name="Appl... » read more

The Week in Review: IoT
By Jeff Dorsch - 08 Jul, 2016 - Comments: 0

Networks The Netherlands and South Korea are both laying claim to installing the first nationwide Internet of Things networks in the world. In the Netherlands, KPN has connected the country with a low-power, wide-area network optimized for IoT. SK Telecom is serving Korea with coast-to-coast IoT coverage, and the Korean carrier plans to spend up to $86.8 million through the end of 2017 on upg... » read more

Atomic Layer Etch Heats Up
By Mark LaPedus - 29 Jun, 2016 - Comments: 0

The atomic layer etch (ALE) market is starting to heat up as chipmakers push to 10nm and beyond. ALE is a promising next-generation etch technology that has been in R&D for the last several years, but until now there has been little or no need to use it. Unlike conventional etch tools, which remove materials on a continuous basis, ALE promises to selectively and precisely remove targete... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Jun, 2016 - Comments: 0

Chipmakers It’s been a difficult time for Intel. The chip giant recently announced a major layoff. It also ceased development on several cell-phone chip products. Intel hasn’t given up on Moore’s Law, but the nodes appear to be extending from 18 to 24 months or perhaps longer, at least at Intel. Here’s the latest: For 10nm production, Intel received the production fab tools in Ap... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Jun, 2016 - Comments: 0

Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

The Week In Review: IoT
By Jeff Dorsch - 27 May, 2016 - Comments: 0

Tools Mentor Graphics rolled out a tester for thermal reliability of electric and hybrid vehicles during power cycling. The tester is the first of its kind. Deals Rambus signed a deal with Eurobank Poland for a cloud-based mobile payment system. The deal involves Secure Element in the Cloud software from Bell ID, which Rambus acquired in January. Eurobank Poland has more than 1 million cus... » read more

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