tag: Gartner

Gartner Recommends Network-on-Chip (NoC) Technology For SoC Design
By Kurt Shuler - 21 Nov, 2013 - Comments: 0

In their latest Hype Cycle for Semiconductors and Electronics Technologies report, Gartner Research has taken the bold step of recommending that all enterprises involved in advanced SoC design should seriously evaluate network-on-chip (NoC) technology based interconnect fabric IP: “The technology has continued to receive a good amount of publicity along with continued adoption by leading S... » read more

Rethinking Old Sayings
By Jon McDonald - 21 Nov, 2013 - Comments: 0

One of my favorite quotes from Gary Smith is a few years old: “It’s the software, stupid!” That statement was made way back in 2006. While it was, and in some ways still is, very illustrative, I believe it also points to one extreme in the back and forth between focusing on hardware then software to differentiate our electronic systems. At the point in time Gary made the statement that... » read more

The Hunt For The Next Application To Drive System-Level Design And Verification
By Frank Schirrmeister - 20 Nov, 2013 - Comments: 0

In recent years, most of my customer presentations highlighted some type of mobile device – system and system on chip (SoC) — to explain the challenges for system-level design and verification. But I also like to look into other application domains to understand how challenges may develop over time and to identify similarities and differences in challenges between application domains. Co... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 15 Nov, 2013 - Comments: 0

Gartner says the natural life cycle of a technology-driven company is less than 10 years. “To compete in this environment, business leaders must destroy and rebuild the very businesses they helped create,” said Steve Prentice, vice president and Gartner Fellow. He cited examples of IBM Personal Systems Group, Nokia, MySpace, Kodak, Borders, HMV and other companies that have struggled or eve... » read more

Collaborate Or Go Home
By Jeff Chappell - 14 Nov, 2013 - Comments: 0

Technology is hard. It's no secret that it's more difficult than ever to keep devices shrinking while increasing performance. It's also old news that it is increasingly costly to be at the leading edge, as semiconductor production technology gets ever more complex — even as a maturing chip industry becomes ever more dependent on low-cost consumer devices. But it has made for some strang... » read more

Momentum Builds For Monolithic 3D ICs
By Mark LaPedus - 14 Nov, 2013 - Comments: 1

The 2.5D/3D chip market is heating up on several fronts. On one front, stacked-die using through-silicon vias (TSVs) is taking root. In a separate area, Samsung is sampling the world’s first 3D NAND device, with Micron and SK Hynix expected to follow suit. And now, there is another technology generating steam—monolithic 3D integrated circuits. In stacked-die, bare die are connected using... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 08 Nov, 2013 - Comments: 0

GT Advanced Technologies has entered into a multi-year supply agreement with Apple for sapphire materials. GT will own and operate its furnaces and related equipment to produce the sapphire materials at an Apple-owned facility in Arizona. GT expects to employ more than 700 people in the facility. Apple will provide GT with a prepayment of about $578 million. “We believe Apple likely has signi... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 01 Nov, 2013 - Comments: 0

Silver surfers represent a more important technology market than “Generation X” and “Generation Y,” according to research from Gartner. Silver surfers are people in middle age or approaching old age. Although most technologists fail to recognize this fact, they are very interested in using technology and also have the time and the resources to pursue their interests, according to Gartne... » read more

Temporary Bonding, Debonding Remains Challenging For TSV Adoption
By Jeff Chappell - 28 Oct, 2013 - Comments: 0

By Jeff Chappell One issue with the adoption of TSVs in 3D ICs in mainstream semiconductor applications revolves around the throughput of the temporary wafer bonding and debonding process. This doesn't necessarily equate to a roadblock, but work certainly remains to be done on this and related issues. On one hand, TSVs already are being used in the manufacturing of compound semiconductors ... » read more

There’s A New Paradigm In Town
By Kurt Shuler - 24 Oct, 2013 - Comments: 0

I recently wrote an article in the October 9th issue of EETimes that appears to have rattled the semiconductor industry a bit. Entitled “Wake Up, Semi Industry: System OEMs Might Not Need You,” the article conveyed the fact that many system-level OEMs now have the capability — and desire — to develop their own application-specific chips. This may be news to many. But a simple review... » read more

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