Week 39: How Safe Is Your Car?

By Anne Cirkel - 06 Mar, 2015 - Comments: 0

In the age of increased connectivity, security is a major concern for all of us. Every few weeks seem to bring news of another massive breach, making it impossible not to be wary of the security threats we face every day when paying with our credit or debit cards online or in a store. There are so many examples that I’ve occasionally wondered whether I should go back to cash payments. For now... » read more

Fill ‘Er Up With Hydrogen

By Kenji Tsuda - 16 Apr, 2014 - Comments: 0

Japan’s Nihon Keizai Newspaper reported recently that Toyota and Honda would release fuel cell vehicles (FCV) in 2015 at a price of 10 million yen ($98,000) or less. This follows a decline in popularity of electric vehicles due to limited range per charge. FCVs use a generator rather than a battery, which means they need to be filled with hydrogen. The current cost of an FCV is more than 1... » read more

Better Software. Faster!

By Tom De Schutter - 27 Mar, 2014 - Comments: 0

As virtual prototyping has seen a wide adoption over the last couple of years, it felt like the right time to work with industry leaders across multiple applications and publish a book that captures the best practices in virtual prototyping. As editor of the book: Better Software. Faster!, I had the privilege to work with some incredibly knowledgeable people who have been deploying virtual prot... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: General Motors

Week 39: How Safe Is Your Car?

Fill ‘Er Up With Hydrogen

Better Software. Faster!