What’s Missing From Machine Learning

By Ed Sperling - 01 Sep, 2016 - Comments: 1

Machine learning is everywhere. It's being used to optimize complex chips, balance power and performance inside of data centers, program robots, and to keep expensive electronics updated and operating. What's less obvious, though, is there are no commercially available tools to validate, verify and debug these systems once machines evolve beyond the final specification. The expectation is th... » read more

Manufacturing Bits: Aug. 9

By Mark LaPedus - 09 Aug, 2016 - Comments: 0

Faster FEBIDs Focused electron beam induced deposition (FEBID) is generating steam in the industry. Still in the R&D stage, FEBID makes use of an electron beam from a scanning electron microscope. Basically, it decomposes gaseous molecules, which, in turn, deposit materials and structures on a surface at the nanoscale. One of the big applications is a futuristic manufacturing technology... » read more

Rethinking Processor Architectures

By Ed Sperling - 05 May, 2016 - Comments: 2

The semiconductor industry's obsession with clock speeds, cores and how many transistors fit on a piece of silicon may be nearing an end for real this time. The [getentity id="22048" comment="IEEE"] said it will develop the International Roadmap for Devices and Systems (IRDS), effectively setting the industry agenda for future silicon benchmarking and adding metrics that are relevant to specifi... » read more

7nm Fab Challenges

By Mark LaPedus - 21 Apr, 2016 - Comments: 3

Leading-edge foundry vendors have made the challenging transition from traditional planar processes into the finFET transistor era. The first [getkc id="185" kc_name="finFETs"] were based on the 22nm node, and now the industry is ramping up 16nm/14nm technologies. Going forward, the question is how far the finFET can be scaled. In fact, 10nm finFETs from Samsung are expected to ramp by ye... » read more

Manufacturing Bits: Dec. 23

By Mark LaPedus - 23 Dec, 2015 - Comments: 0

World’s smallest inkjet image ETH Zurich and Scrona have set the official world’s record for the smallest inkjet-printed color image. The feat, which has been recognized by the Guinness World Records, is based on Scrona’s so-called NanoDrip printing technology and quantum dots. ETH and Scrona printed an image of clown fishes and sea anemones. The printed image measures 0.0092mm² in a... » read more

Power/Performance Bits: Oct. 13

By Jesse Allen - 13 Oct, 2015 - Comments: 0

Cooling down FPGAs Georgia Institute of Technology researchers found a way to put liquid cooling a few hundred microns away from where the transistors are operating by cutting microfluidic passages directly into the backsides of production FPGAs. The research, backed by DARPA, is believed to be the first example of liquid cooling directly on an operating high-performance CMOS chip. To ... » read more

Energy Harvesting Update

By Ed Sperling - 18 May, 2015 - Comments: 0

Manos Tentzeris, professor of electrical and computer engineering at the Georgia Institute of Technology, sat down with Semiconductor Engineering to discuss energy harvesting. What follows are excerpts of that conversation. SE: What is the state of energy harvesting and are we making progress. Tentzeris: The latest results are systems with efficiency up to 40% to 45% utilizing ambient UH... » read more

Disruptive R&D

By Paula Doe - 17 Jul, 2014 - Comments: 0

Leading university researchers presented their most promising technologies — describing developments ranging from sustainable metal cluster technology (that’s already spawned three notable startups) to resonance-based detection for more accurate MEMS devices — at the new Breakthrough Research Technologies session and the Silicon Innovation Forum at SEMICON West 2014. OSU metal cluster... » read more

What Comes Next?

By SEMI - 27 Jun, 2014 - Comments: 0

The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 (www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between sem... » read more

Power/Performance Bits: Feb. 25

By Ann Mutschler - 25 Feb, 2014 - Comments: 0

SiGe chip sets speed record Researchers from IHP-Innovations for High Performance Microelectronics in Germany and the Georgia Institute of Technology have demonstrated what they say is the world's fastest silicon-based device to date. A silicon-germanium (SiGe) chip has been operated transistor at 798 gigahertz (GHz) fMAX, exceeding the previous speed record for silicon-germanium chips by abou... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Georgia Institute of Technology