Chip Industry Technical Paper Roundup: May 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=430 /] Find more semiconductor research papers here.   » read more

Comparisons of HW Versus SW Implementation of Warp Level Features in Vortex RISC-V GPU (Georgia Tech, IIT)


A new technical paper titled "Hardware vs. Software Implementation of Warp-Level Features in Vortex RISC-V GPU" was published by researchers at Georgia Tech and Indian Institute of Technology Bombay. Abstract "RISC-V GPUs present a promising path for supporting GPU applications. Traditionally, GPUs achieve high efficiency through the SPMD (Single Program Multiple Data) programming model. Ho... » read more

Chip Industry Technical Paper Roundup: May 6


New technical papers recently added to Semiconductor Engineering’s library: [table id=427 /] Find more semiconductor research papers here.   » read more

Optimizing End-to-End Communication And Workload Partitioning In MCM Accelerators (Georgia Tech)


A new technical paper titled "MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules" was published by researchers at Georgia Tech. Abstract "Increasing AI computing demands and slowing transistor scaling have led to the advent of Multi-Chip-Module (MCMs) based accelerators. MCMs enable cost-effective scalability, higher yield, and modular reuse by par... » read more

Chip Industry Week in Review


To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Chip Industry Week In Review


[Podcast version is here.] TSMC said it will produce 30% of its leading-edge chips in Arizona when all six of its fabs are operational, a total investment of $165 billion, Axios reported. In its latest SEC filing, the foundry said it continues to add capacity in Taiwan, Arizona, Japan, and Germany. The Trump administration launched a Section 232 investigation into semiconductors and relat... » read more

Chip Industry Week In Review


Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

Chip Industry Technical Paper Roundup: Mar. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=415 /] Find more semiconductor research papers here. » read more

Wearable Connectivity, AI Enable New Use Cases


The sensing and processing technology used in smart phones, watches, and rings is starting to be being deployed in a wide variety of wearable devices, ranging from those that fill the gap between sports and med tech, to haptic devices to assist the visually impaired and AR/VR glasses. Emerging applications include payment, building, and factory wearables. Most of these devices process signal... » read more

Chip Industry Week In Review


Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

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