A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS


A technical paper titled "A 112-Gb/s —8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes" was published by researchers at University of Toronto, Alphawave IP, and Huawei Technologies Canada. Abstract: "A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude... » read more

Advanced Modulation And Coding Challenges


Demands for a connected world with instant data access continue to drive data center transceiver innovation. 100 gigabit Ethernet (GE) data transmission is in production and will continue to evolve. But 100GE speeds aren’t fast enough to support the expected surge in connected devices and the applications they will run, opening the door for 400GE. Non-return-to-zero (NRZ) and four-level pulse... » read more

How To Build An Automotive Chip


The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

Altering A Car’s Behavior With Updates


The electronic content inside a car is growing rapidly, which is having a big effect on the way in which different vehicles are designed and built. As a direct consequence of this, the biggest technical change is now beginning to happen – one that overturns the traditional relationship between the car manufacturer and the car owner. With many subsystems now controlled by microprocessors ru... » read more