tag: GlobalFoundries

Blog Review: Aug. 3
By Jesse Allen - 03 Aug, 2016 - Comments: 0

Mentor's Andrew Macleod presents three hours of highlights from this year's IESF automotive conference in Detroit with topics from making cars more affordable to reaching an efficiency of 54.5 MPG. Cadence's Paul McLellan checks out the state of the smartphone landscape now that consolidation in the market seems to be complete at the Linley Mobile Conference. Synopsys' Eric Huang consider... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jul, 2016 - Comments: 0

Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

The Week In Review: Design
By Jesse Allen - 29 Jul, 2016 - Comments: 0

IP Rambus debuted 3200 Mbps DDR4 PHY, targeted at the data center and networking markets, on the GlobalFoundries FX-14 ASIC platform using the company's 14nm Power Plus (LPP) process. The PHY is DFI 4.0 compatible, and supports 16 – 72-bit interfaces, along with single and multi-rank configurations. Synopsys introduced VIP and UVM source code test suite for Ethernet 200G, supporting 4x5... » read more

Architecting Memory For Next-Gen Data Centers
By Frank Ferro - 26 Jul, 2016 - Comments: 2

The industry’s insatiable appetite for increased bandwidth and ever-higher transfer rates is driven by a burgeoning Internet of Things (IoT), which has ushered in a new era of pervasive connectivity and generated a tsunami of data. In this context, datacenters are currently evaluating a wide range of new memory initiatives. All seek to optimize efficiency by reducing data transport, thus sign... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jul, 2016 - Comments: 2

Market research Worldwide semiconductor capital spending is projected to decline 0.7% in 2016, to $64.3 billion, according to Gartner. This is up from the estimated 2% decline in Gartner's previous quarterly forecast. "Economic instability, inventory excess, weak demand for PC’s, tablets, and mobile products in the past three years has caused slow growth for the semiconductor industry. This ... » read more

To 7nm And Beyond
By Ed Sperling - 21 Jul, 2016 - Comments: 4

Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], and Thomas Caulfield, senior vice president and general manager of Fab 8, sat down with Semiconductor Engineering to discuss future directions in technology, including the next rev of FD-SOI, the future of Moore’s Law, and how some very public challenges will likely unfold. SE: What do you see as the... » read more

Building Faster Chips
By Ed Sperling - 21 Jul, 2016 - Comments: 5

By Ed Sperling and Jeff Dorsch An explosion in IoT sensor data, the onset of deep learning and AI, and the commercial rollout of augmented and virtual reality are driving a renewed interest in performance as the key metric for semiconductor design. Throughout the past decade in which mobility/smartphone dominated chip design, power replaced performance as the top driver. Processors ha... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jul, 2016 - Comments: 0

Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

E-beam Vs. Optical Inspection
By Mark LaPedus - 11 Jul, 2016 - Comments: 0

The wafer inspection business is heating up as chipmakers encounter new and tiny killer defects in advanced devices. Last month ASML Holding entered into an agreement to acquire Hermes Microvision (HMI), the world’s largest e-beam inspection vendor, for $3.1 billion. The proposed move propelled ASML into the e-beam wafer inspection market. In addition, [getentity id="22817" e_name="Appl... » read more

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