tag: GlobalFoundries

Virtual IDM Progress Report
By Ed Sperling - 06 Dec, 2012 - Comments: 0

By Ed Sperling Complexity, tight power budgets, disaggregation of the supply chain and market fragmentation are conspiring to force much tighter partnerships among companies that develop different pieces of an SoC, as well as those that collaborate on even larger systems. This confluence of factors has forced the rules for how companies work together to be rewritten, but even within that frame... » read more

Chip Architect Challenges
By Ed Sperling - 06 Dec, 2012 - Comments: 0

By Ann Steffora Mutschler Product lifecycles can be shorter than the design cycle and even the process development cycle, particularly in the consumer handheld device market. It’s up to the chip architect to decide how the functions should be implemented. The good news is there are a number of options available, ranging from mapping the design to 2.5D technology, moving to finFET tr... » read more

Experts At The Table: Obstacles In Low-Power Design
By Ed Sperling - 06 Dec, 2012 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power design with with Leah Clark, associate technical director at Broadcom; Richard Trihy, director of design enablement at GlobalFoundries; Venki Venkatesh, engineering director at Atrenta; and Qi Wang, technical marketing group director at Cadence. What follows are excerpts of that conversation. LPHP: If you ar... » read more

Experts At The Table: Obstacles In Low-Power Design
By Ed Sperling - 06 Dec, 2012 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power design with with Leah Clark, associate technical director at Broadcom; Richard Trihy, director of design enablement at GlobalFoundries; Venki Venkatesh, engineering director at Atrenta; and Qi Wang, technical marketing group director at Cadence. What follows are excerpts of that conversation. LPHP: If you ar... » read more

To Shrink Or Not To Shrink…And How Much?
By Ed Sperling - 29 Nov, 2012 - Comments: 0

By Ann Steffora Mutschler The 28nm semiconductor manufacturing node is in full swing with 20nm process development ramping quickly. As such, the industry has been looking ahead to the next node shrink to achieve the power, performance and cost advantages that a node shrink promises. However, as we are well aware by now, traditional CMOS planar technology is not scaling as it did in previous ge... » read more

Experts At The Table: Obstacles In Low-Power Design
By Ed Sperling - 16 Nov, 2012 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power design with with Leah Clark, associate technical director at Broadcom; Richard Trihy, director of design enablement at GlobalFoundries; Venki Venkatesh, engineering director at Atrenta; and Qi Wang, technical marketing group director at Cadence. What follows are excerpts of that conversation. LPHP: What effe... » read more

Node Skipping Reaches New Heights
By Ed Sperling - 15 Nov, 2012 - Comments: 0

By Mark LaPedus For years, silicon foundries have rolled out their respective leading-edge processes roughly on a two-year cadence. The long-standing goal has been to keep foundry customers on a competitive price, power and performance curve. But as leading-edge chipmakers move from the 28nm node and beyond, the predictable process progression is changing. And the phenomenon of “node skip... » read more

Facing Up To RC Delay
By Ed Sperling - 15 Nov, 2012 - Comments: 0

y Ed Sperling Resistance and capacitance delays have always been someone else’s problem to solve at some fuzzy process node in the future, and for the most part manufacturers and equipment makers have done a wizard-like job of making this problem go away. They can’t make it disappear anymore, though, and beginning at 14nm and beyond RC delay is becoming more than just an annoyance. The ... » read more

Mobile Memory Madness
By Ed Sperling - 15 Nov, 2012 - Comments: 0

By Mark LaPedus The insatiable thirst for more bandwidth in smartphones, tablets and other devices has prompted an industry standards body to revamp its mobile memory interface roadmap. As part of the changes, the Joint Electron Devices Engineering Council (JEDEC) has scaled back the initial version of Wide I/O technology and pushed out the introduction date of a true 3D stacked architectur... » read more

The Growing Integration Challenge
By Ed Sperling - 08 Nov, 2012 - Comments: 0

By Ed Sperling As the number of processors and the amount of memory and IP on a chip continues to skyrocket, so does the challenge for integrating all of this stuff on a single die—or even multiple dies in the same package. There are a number of reasons why it’s getting more difficult to make all of these IP blocks work together. First of all, nothing ever stands still in design. As a r... » read more

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