Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 01 Sep, 2023 - Comments: 0

The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Week In Review: Design, Low Power

By Susan Rambo - 01 Sep, 2023 - Comments: 0

Design & IP Arm launched the Neoverse Compute Subsystems (CSS), pre-integrated and validated configurations of Arm Neoverse platform IP, at this week's Hot Chips conference. CSS helps streamline SoC designs for data centers and is optimized for an advanced 5nm process. The first generation of CSS (Neoverse CSS N2) is based on Arm’s Neoverse N2 platform. Core count is configurable (24 to ... » read more

Week In Review: Automotive, Security and Pervasive Computing

By Linda Christensen - 18 Aug, 2023 - Comments: 0

The AAA Foundation for Traffic Safety estimates that between 2021 and 2050, ADAS technologies currently available to U.S. will prevent "approximately 37 million crashes, 14 million injuries, and nearly 250,000 deaths, which would represent 16% of crashes and injuries, and 22% of deaths that would otherwise occur on U.S. roads without these technologies," according to a new report. Governmen... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 11 Aug, 2023 - Comments: 0

Intel issued an advisory of a potential security vulnerability in some of its processors. The company recommends updating to the latest firmware version. NVIDIA unveiled its GH200 Grace Hopper platform, based on 144 Arm Neoverse cores and 282GB of HBM3e memory. Meanwhile, Chinese internet companies including Baidu, ByteDance, Tencent, and Alibaba ordered about $5 billion worth of A800 proces... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing

By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Multiple Hurdles In The Race To 6G

By John Koon - 03 Aug, 2023 - Comments: 0

The rollout of 6G will open the door to significant changes and possibilities, but whether this technology lives up to the hype will require massive collaborative efforts, huge investments in infrastructure, and solving some problems for which there are no precedents. Multiple companies are already working on 6G technology, aiming for a maximum download speed of one terabit per second (Tb/s)... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 28 Jul, 2023 - Comments: 0

BMW, General Motors, Honda, Hyundai, Kia, Mercedes-Benz, and Stellantis will create an electric vehicle charging network, installing more than 30,000 high-powered DC charge points accessible to any cars that use Combined Charging System (CCS) or North American Charging Standard (NACS) connectors. Opening summer 2024, the network will leverage Plug & Charge technology and allow easy digital ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 14 Jul, 2023 - Comments: 0

Google was hit with a class action suit in U.S. District Court in San Francisco, alleging data scraping from millions of users without consent and violation of copyright laws to train and develop its AI products. Last month, the same law firm filed a suit against OpenAI for ChatGPT. Despite calling for a pause on development of advanced AI in March, Elon Musk launched xAI, a new company focu... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 07 Jul, 2023 - Comments: 0

Joby Aviation and Alef Automotive each received a Special Airworthiness Certificate from the U.S. Federal Aviation Administration (FAA) for an electric vertical take-off and landing (eVTOL) aircraft. Joby will now begin flight testing the prototype, and the aircraft will move to Edwards Air Force Base in 2024 as part of a contract with the U.S. Air Force. Alef’s model is the first U.S. govern... » read more

Research Bits: June 20

By Susan Rambo - 20 Jun, 2023 - Comments: 0

Quantum takes a Helium 3 bath A team of researchers from National Physical Laboratory, Royal Holloway University of London, Chalmers University of Technology, and Google have found that immersing superconducting quantum circuits in a bath of Helium-3 (3He) can cool down quantum circuits to almost 100 times lower than was possible before, to achieve under a thousand of a degree above absolute z... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Google

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Automotive, Security and Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing

Multiple Hurdles In The Race To 6G

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Research Bits: June 20