tag: Google

Week In Review: Design, Low Power
By Jesse Allen - 12 May, 2023 - Comments: 1

Synopsys acquired Silicon Frontline Technology, a provider of an electrical layout verification solution for mixed-signal and analog designs, large-scale power semiconductor devices, and electrostatic discharge protection networks. "This acquisition enables Synopsys to extend the capabilities of our design analysis portfolio and help build out a system-level electrical analysis platform. We als... » read more

Pinpointing Timing Delays Can Improve Chip Reliability
By Anne Meixner - 09 May, 2023 - Comments: 0

Growing pressure to improve IC reliability in safety- and mission-critical applications is fueling demand for custom automated test pattern generation (ATPG) to detect small timing delays, and for chip telemetry circuits that can assess timing margin over a chip's lifetime. Knowing the timing margin in signal paths has become an essential component in that reliability. Timing relationships a... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 May, 2023 - Comments: 0

Pervasive computing Microsoft and AMD are working together on an AI processor, according to a report in Bloomberg. Tenstorrent adopted Arteris IP’s Ncore and FlexNoC interconnect IP for its AI RISC-V chiplets. The chiplets will be configurable for different uses and workloads. Some use cases include AI high-performance computing for data center, such as cloud servers, and edge devices and... » read more

New Standards Push Co-Packaged Optics
By Karen Heyman - 26 Apr, 2023 - Comments: 0

Co-packaged optics (CPOs) promise five times the bandwidth of pluggable connections, but the new architecture requires multiple changes to accommodate different applications. The Optical Internetworking Forum (OIF) recently published standards for co-packaged optics, which are the photonic industry’s hope for handling today’s faster Ethernet interfaces, as well as increasing speeds and p... » read more

Chip Industry’s Technical Paper Roundup: Apr. 25
By Linda Christensen - 25 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=94 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Hyperscale HW Optimized Neural Architecture Search (Google)
By Technical Paper Link - 21 Apr, 2023 - Comments: 0

A new technical paper titled "Hyperscale Hardware Optimized Neural Architecture Search" was published by researchers at Google, Apple, and Waymo. "This paper introduces the first Hyperscale Hardware Optimized Neural Architecture Search (H2O-NAS) to automatically design accurate and performant machine learning models tailored to the underlying hardware architecture. H2O-NAS consists of three ... » read more

Chip Industry’s Technical Paper Roundup: Apr. 10
By Linda Christensen - 10 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=92 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Google’s TPU v4 Architecture: 3 Major Features
By Technical Paper Link - 07 Apr, 2023 - Comments: 0

A new technical paper titled "TPU v4: An Optically Reconfigurable Supercomputer for Machine Learning with Hardware Support for Embeddings" was published by researchers at Google. Abstract: "In response to innovations in machine learning (ML) models, production workloads changed radically and rapidly. TPU v4 is the fifth Google domain specific architecture (DSA) and its third supercomputer f... » read more

Growing Challenges For Increasingly Connected Vehicles
By John Koon - 06 Apr, 2023 - Comments: 0

Automobiles will become increasingly connected over the next decade, but that connectivity will come at a price in terms of dollars, security, and constantly changing technology. Connectivity involves all parts of a vehicle. It includes everything from autonomous driving to in-cabin monitoring and connected infotainment. And it encompasses external sensors, IoT, V2X, over-the-air communicati... » read more

Chip Industry’s Technical Paper Roundup: Mar. 6
By Linda Christensen - 06 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=84 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

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