Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices

New technical paper titled "A Review on Transient Thermal Management of Electronic Devices" from researchers at Indian Institute of Technology Bombay. Abstract "Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varyi... » read more

Mapping Heat Across A System

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Power/Performance Bits: Feb. 8

Transparent sensor Researchers at Osaka University created a thin, flexible, transparent sensor using silver nanowire networks. High-resolution printing was used to fabricate the centimeter-scale cross-aligned silver nanowire arrays, with reproducible feature sizes from 20 to 250 micrometers. As a proof-of-concept for functionality, they used their arrays to detect electrophysiological signals... » read more