Chip Industry’s Technical Paper Roundup: September 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=146 /] More Reading Technical Paper Library home » read more

Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP


A technical paper titled “REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal” was published by researchers at Swiss Federal Institute of Technology Lausanne (EPFL) and University of Applied Sciences and Arts of Western Switzerland (HES-SO). Abstract Excerpt "In this work, we propose a new task mapping heuristic that leverages in-package wireless t... » read more