Big Changes Ahead For Photomask Technology

By Gregory Haley - 19 Oct, 2023 - Comments: 0

The move to curvilinear shapes on photomasks is gaining steam after years of promise as a way of improving yield, lowering defectivity, and reducing wasted space on a die — all of which are essential for both continued scaling and improved reliability in semiconductors. Interest in this approach ran high at this year's SPIE Photomask Technology + EUV Lithography Conference. Put simply, cur... » read more

Challenges Grow For CD-SEMs At 5nm And Beyond

By Gregory Haley - 11 Apr, 2023 - Comments: 1

CD-SEM, the workhorse metrology tool used by fabs for process control, is facing big challenges at 5nm and below. Traditionally, CD-SEM imaging has relied on a limited number of image frames for averaging, which is necessary both to maintain throughput speeds and to minimize sample damage from the electron beam itself. As dimensions get smaller, these limitations result in higher levels of n... » read more

Advanced Digital Process Nodes Drive Semiconductor Test Innovations

By Regan Mills - 07 Mar, 2023 - Comments: 0

Global internet traffic is growing exponentially, with no sign of slowing, and this demand is driving the evolution of the semiconductor industry. The appetite for more and more data requires sensors for capturing the data, networks for moving the data, storage, and processing power to analyze the data. As the demand for data grows, the underlying technologies must advance to not only meet toda... » read more

EUV’s New Problem Areas

By Mark LaPedus - 19 Mar, 2018 - Comments: 2

Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

Looming Issues And Tradeoffs For EUV

By Mark LaPedus - 25 Sep, 2017 - Comments: 5

Momentum is building for extreme ultraviolet (EUV) lithography, but there are still some major challenges to solve before this long-overdue technology can be used for mass production. [gettech id="31045" comment="EUV"] lithography—a next-generation technology that patterns tiny features on a chip—was supposed to move into production around 2012. But over the years, EUV has encountered se... » read more

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Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

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The critical, and growing, significance of mature node chips and processes.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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Megafabs churning out the most advanced processors are not the only game in town.

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tag: high-volume manufacturing

Big Changes Ahead For Photomask Technology

Challenges Grow For CD-SEMs At 5nm And Beyond

Advanced Digital Process Nodes Drive Semiconductor Test Innovations

EUV’s New Problem Areas

Looming Issues And Tradeoffs For EUV

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