tag: Hot Chips

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 16 Sep, 2022 - Comments: 0

Automotive and mobility U.S. President Joe Biden announced the approval of $900 million in funding for a nationwide network of electrical vehicle charging stations in 35 states. The money is part of a multi-year, $7.5 billion plan to create 500,000 charging stations along federal highways. Industry executives told Reuters that remote human supervisors may be a permanent fixture of highly au... » read more

Will Big Competition Attract More Talent For IC Companies?
By Marie C. Baca - 26 May, 2022 - Comments: 1

Google is hiring a chip packaging technologist. General Motors is seeking a wafer fabrication procurement specialist. Facebook Reality Labs wants a materials researcher with experience in photolithography and nanoimprint techniques. Recent job postings by tech and automotive giants are enough to worry any chip company executive struggling to attract talent. But what may seem at first like a ... » read more

ML Focus Shifting Toward Software
By Bryon Moyer - 03 Feb, 2022 - Comments: 1

New machine-learning (ML) architectures continue to garner a huge amount of attention as the race continues to provide the most effective acceleration architectures for the cloud and the edge, but attention is starting to shift from the hardware to the software tools. The big question now is whether a software abstraction eventually will win out over hardware details in determining who the f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Aug, 2021 - Comments: 0

Chipmakers, OEMs Reports have surfaced that TSMC has delayed its 3nm process. But TSMC says the technology remains on track. Volume production for TSMC’s 3nm is still scheduled for the second half of 2022. On the flip side, there is speculation that TSMC may increase its wafer prices by up to 20%, according to a report from the Taipei Times. Here's another report. This is due to chip shortag... » read more

New Architectures, Much Faster Chips
By Ed Sperling and Ann Mutschler - 31 Aug, 2020 - Comments: 0

The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

The Next Leap
By Ed Sperling - 14 Aug, 2020 - Comments: 0

Some interesting new technologies are about to go on display. Chipmakers and systems companies have been working on quantum computing, photonics, and specialized AI processors, for the past several years, and those efforts are beginning to gain momentum. The goal is no longer a doubling of performance and power. It's now orders of magnitude improvement, and next week's Hot Chips conference i... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Aug, 2020 - Comments: 0

Cadence added new machine learning functionality to its Xcelium Logic Simulator to speed verification closure on randomized regressions. Xcelium ML directly interfaces to the simulation kernel and learns iteratively over an entire simulation regression, guiding the Xcelium randomization kernel on subsequent regression runs to achieve matching coverage with reduced simulation cycles. Kioxia adop... » read more

System-in-Package For Heterogeneous Designs
By Paul McLellan - 12 Dec, 2019 - Comments: 1

System integration is increasingly being done using 3D packaging technologies rather than integrating everything onto a huge SoC. One motivation is the ability to not just to split up a design in a single process, but to package die from different processes. Sometimes there are economic reasons. Several presentations at HOT CHIPS had a partition of the design into the processor itself, and a... » read more

Chiplets, Faster Interconnects, More Efficiency
By Ed Sperling - 22 Aug, 2019 - Comments: 1

Big chipmakers are turning to architectural improvements such as chiplets, faster throughput both on-chip and off-chip, and concentrating more work per operation or cycle, in order to ramp up processing speeds and efficiency. Taken as a whole, this represents a significant shift in direction for the major chip companies. All of them are wrestling with massive increases in processing demands ... » read more

Finding Security Holes In Hardware
By Ed Sperling - 06 Sep, 2018 - Comments: 0

At least three major security holes in processors were identified by Google's Project Zero over the past year, with more expected to roll out in coming months. Now the question is what to do about them. Since the beginning of the PC era, two requirements for hardware were backward compatibility and improvements in performance with each new version of processors. No one wants to replace their... » read more

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