tag: HPC

Meeting 112 SerDes Based System Design Challenges
By Madhumita Sanyal - 12 May, 2022 - Comments: 0

The need for higher bandwidth networking equipment as well as connectivity in the cloud and hyperscale data centers is driving the switch technology transition from 25Tb/s (terabytes) to 51Tb/s and soon to 100Tb/s. The industry has chosen Ethernet to drive the switch market, using 112G SerDes or PHY technology today and 224G SerDes in the future. This article describes how designers can overcom... » read more

Choosing The Right Server Interface Architectures For High Performance Computing
By Jerry Lotto - 12 Apr, 2022 - Comments: 0

The largest bulk and cost of a modern high-performance computing (HPC) installation involves the acquisition or provisioning of many identical systems, interconnected by one or more networks, typically Ethernet and/or InfiniBand. Most HPC experts know that there are many choices between different server manufacturers and the options of form factor, CPU, RAM configuration, out of band management... » read more

Analytical Energy Model Parametrized by Workload, Clock Frequency and Number of Active Cores for Share-Memory High-Performance Computing Applications
By Technical Paper Link - 04 Apr, 2022 - Comments: 0

New academic paper from University of Mons (Belgium) and Universidade Federal do Rio Grande do Norte (Brazil). Abstract "Energy consumption is crucial in high-performance computing (HPC), especially to enable the next exascale generation. Hence, modern systems implement various hardware and software features for power management. Nonetheless, due to numerous different implementations, we ca... » read more

Chiplets Enter The Supercomputer Race
By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

SparseP: Towards Efficient Sparse Matrix Vector Multiplication on Real Processing-In-Memory Systems
By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract "Several manufacturers have already started to commercialize near-bank Processing-In-Memory (PIM) architectures. Near-bank PIM architectures place simple cores close to DRAM banks and can yield significant performance and energy improvements in parallel applications by alleviating data access costs. Real PIM systems can provide high levels of parallelism, large aggregate memory bandwi... » read more

The Ethernet Evolution
By Ed Sperling - 01 Mar, 2022 - Comments: 0

Ethernet was expected to be long gone by now, but predictions of its demise were decades premature. John Swanson, senior product marketing manager for high-performance computing digital IP at Synopsys, talks about how Ethernet has evolved over the past 45 or so years from a somewhat “boring” technology to one that is at the forefront of data center performance improvements, with more update... » read more

Thermal Management Implications For Heterogeneous Integrated Packaging
By Cameron Nelson - 17 Feb, 2022 - Comments: 1

As the semiconductor industry reaches lower process nodes, silicon designers struggle to have Moore's Law produce the results achieved in earlier generations. Increasing the die size in a monolithic system on chip (SoC) designs is no longer economically viable. The breakdown of monolithic SoCs into specialized chips, referred to as chiplets, presents significant benefits in terms of cost, yield... » read more

The Ethernet Standard: To IP And Beyond
By Jerry Lotto - 13 Jan, 2022 - Comments: 0

Ethernet is ubiquitous—it is the core technology that defines the Internet and serves to connect the world in ways that people could not imagine even one generation ago. HPC clusters are working on solving the most challenging problems facing humanity—and cloud computing is the service hosting many of the application workloads struggling with these questions. While alternative network infra... » read more

Veloce Prototyping Solutions Accelerate Verification Of HPC AI-Enabled SoCs
By Siemens EDA - 08 Dec, 2021 - Comments: 0

This white paper goes through the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design. The starting point in the journey explores the use cases for designs illustrating the impact HPC AI-enabled systems and resources have on o... » read more

A Broad Look Inside Advanced Packaging
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Choon Lee, chief technology officer of JCET, sat down with Semiconductor Engineering to talk about the semiconductor market, Moore’s Law, chiplets, fan-out packaging, and manufacturing issues. What follows are excerpts of that discussion. SE: Where are we in the semiconductor cycle right now? Lee: If you look at 2020, it was around 10% growth in the overall semiconductor industry. ... » read more

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